Monolithic Gas Distribution Manifold for Semiconductor Processing
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Solution Overview
Problem
Conventional gas delivery systems for semiconductor substrate processing are expensive due to the use of precision-machined metal components, have multiple potential failure points, and introduce contamination and gas delivery delays, while also being inflexible in fluid routing and requiring extensive assembly and leak testing.
Innovation Solution
A gas delivery substrate formed from laminated layers that create a monolithic structure with gas-tight channels, allowing for non-linear fluid routing and reducing the number of seals and assembly time, using materials like ceramics or metals that can be bonded together to house gas supply components closer together, reducing the size and cost of the system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional precision-machined metal components are used in gas delivery systems, then manufacturing precision and reliability are improved, but system cost and device complexity increase
Solution Approach 1:
The patent combines multiple discrete precision-machined metal components (manifolds, valves, flow controllers, seals) into a single integrated gas delivery substrate. This monolithic structure eliminates the need for multiple separate components and their associated interfaces, thereby reducing device complexity while maintaining manufacturing precision through specialized fabrication processes for the substrate.
Solution Approach 2:
The gas delivery substrate serves multiple functions simultaneously: it acts as a manifold for gas distribution, provides mounting surfaces for control components, creates gas-tight seals, and routes multiple gas streams. This multi-functionality consolidates what would traditionally require multiple separate components, reducing overall system complexity while maintaining the precision required for each function.
2Ease of repair
If multiple discrete components with seals are used in gas delivery systems, then ease of repair and modularity are improved, but reliability decreases due to multiple potential failure points
Solution Approach 1:
By integrating multiple components into a single monolithic substrate, the patent eliminates the seals and interfaces between discrete components that create failure points. The unified structure removes these potential leak paths, significantly improving reliability. Repair involves replacing the entire substrate as a single unit rather than attempting to repair multiple separate components.
3Ease of manufacture
If conventional gas delivery systems with linear routing are used, then ease of manufacture is improved, but gas delivery efficiency deteriorates due to longer flow paths and contamination risk
Solution Approach 1:
The patent transitions from linear gas routing to three-dimensional pathways within the monolithic substrate. Gas channels are routed through the volume of the substrate rather than along its surface, allowing for shorter, more direct paths between components. This dimensional change enables complex routing topologies that reduce flow path length and improve gas delivery efficiency while maintaining manufacturing feasibility through specialized fabrication processes.
4Ease of operation
If discrete components are spaced far apart in conventional systems, then ease of operation is improved, but device size increases and contamination risk increases
Solution Approach 1:
The monolithic substrate enables components to be positioned in three-dimensional space rather than only along a linear array. This allows for compact arrangements where components are vertically stacked or positioned at different heights on the substrate surface, reducing the horizontal footprint while maintaining adequate spacing for operation and maintenance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the overall size and cost of the gas delivery system, minimizes contamination and failure points, and enhances gas delivery efficiency by allowing for shorter gas flow paths and more flexible component placement, while maintaining high-quality material usage.
Implementation Method 1
a plurality of layers having major surfaces thereof bonded together to form a laminate
Data Source
AI summary
A gas delivery substrate for mounting gas supply components of a gas delivery system for a semiconductor processing apparatus is provided. The substrate may include a plurality of layers having major surfaces thereof bonded together forming a laminate with openings for receiving and mounting first, second, third and fourth gas supply components on an outer major surface. The substrate may include a first gas channel extending across an interior major surface that at least partially overlaps a second gas channel extending across a different interior major surface. The substrate may include a first gas conduit including the first gas channel connecting the first gas supply component to the second gas supply component, and a second gas conduit including the second channel connecting the third gas supply component to the fourth gas supply component. Also disclosed are various techniques for manufacturing gas delivery substrates.