Monolithic Ground Plane With Snap-Fit Contacts for Compact Aerosol Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electrically operated aerosol generating devices face challenges in manufacturing due to complex electrical connections and limited dimensions, making it difficult to couple components effectively within a housing.
Innovation Solution
A monolithic ground plane with an elongate conductive member that electrically couples the power supply to the electronic circuit board and heating element, while structurally retaining components, using a single laminar blank for easy formation and resilient elements for secure snap-fit connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If traditional separate components and connections are used for power supply and circuit board, then electrical connections can be established, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges the power supply, circuit board, and ground plane into a single integrated monolithic structure. The power supply is positioned on the ground plane with direct electrical contact through contact pads, eliminating the need for separate connection components and reducing manufacturing complexity.
Solution Approach 2:
The ground plane serves multiple functions simultaneously: it provides electrical grounding, structural support for mounting the power supply and circuit board, and thermal management. This multi-functionality reduces the number of separate components needed and simplifies the overall device architecture.
2Volume of moving object
If multiple separate components are used within limited housing dimensions, then functional requirements are met, but available space for connections is reduced
Solution Approach 1:
The power supply is nested directly onto the ground plane structure, with the circuit board positioned above and connected through vertical vias. This nested arrangement maximizes space utilization within the limited housing dimensions while maintaining all necessary electrical connections.
Solution Approach 2:
The patent transitions from planar two-dimensional connections to three-dimensional vertical connections using vias through the ground plane. This allows electrical connections to be made in the vertical dimension, freeing up horizontal space and reducing the overall device footprint.
3Strength
If resilient elements are used for snap-fit connections, then secure mechanical retention is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The resilient elements are designed with specific material properties and geometric parameters that allow them to deform elastically during assembly and provide secure retention. The contact pads are dimensioned to accommodate manufacturing tolerances while maintaining reliable electrical and mechanical connections.
Solution Approach 2:
The resilient elements are pre-designed to accommodate manufacturing variations and assembly tolerances through their elastic deformation capability. This cushioning effect allows for easier assembly while maintaining secure mechanical retention without requiring extremely tight manufacturing tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the manufacturing process by allowing components to be coupled both electrically and structurally before assembly, reducing device size and complexity, and enabling efficient power transfer with adjustable resistance.
Implementation Method 1
an elongate conductive member configured to electrically couple the power supply to the electronic circuit board and the electrical heating element
Implementation Method 2
At least the portion of the ground plane forming the channel is preferably resilient such that the power supply may be inserted into the channel by increasing the width of the open portion of the channel
Data Source
AI summary
A ground plane is provided, including: a monolithic elongated conductive member, a first portion of the monolithic elongated conductive member forming a cavity configured to receive a power supply, a plurality of second portions of the monolithic elongated conductive member respectively forming resilient elements extending over the cavity and configured to retain the power supply within the cavity, and a plurality of third portions of the monolithic elongated conductive member respectively forming parallel pins configured to receive an electronic circuit board. An electrically operated aerosol generating device including the ground plane, a method of forming a ground plane, and a method of forming an electrically operated aerosol generating device are also provided.