Monolithic Hybrid Sensor Array for Pixel-Aligned 3D Imaging

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Solution Overview

Problem

Current 3D imaging systems for applications like ADAS, autonomous driving, AR, and VR face challenges in providing high-resolution and high-quality 3D depth information due to hardware and software limitations, such as bulky form factors, alignment difficulties between 2D and 3D sensors, and substantial computational resources required for data fusion.

Innovation Solution

A hybrid sensing system with a monolithic hybrid sensor array that combines a 2D sensing region for visible light detection and a 3D depth sensing region for near-infrared light detection, using metalenses to direct light and a processing circuit to combine 2D and 3D information, enabling efficient object detection and tracking with reduced computational strain and power consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If separate detection systems are used to provide 2D image data and 3D depth data, then detection capability is improved, but device complexity and alignment difficulty increase

Engineering Contradiction:
Improvedetection capabilityVSAvoidsystem complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines separate 2D imaging sensors and 3D depth sensing sensors into a single hybrid sensor array integrated on one substrate. The 2D sensing region and 3D depth sensing region are merged at the pixel level, allowing both functions to be performed by a unified device rather than multiple separate systems, thereby reducing overall system complexity while maintaining enhanced detection capabilities.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The hybrid sensor array serves multiple functions simultaneously: it performs both 2D color imaging and 3D depth measurement using a single integrated device. Each pixel location can function as either a 2D photodiode or a 3D SPAD, allowing the universal sensor structure to adapt to different sensing modes without requiring separate specialized sensors.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If separate detection systems are used to provide 2D image data and 3D depth data, then detection capability is improved, but alignment difficulty increases

Engineering Contradiction:
Improvedetection capabilityVSAvoidalignment ease
Core Design Contradiction:
Adaptability or versatilityVSEase of operation

Solution Approach 1:

By merging 2D and 3D sensing regions into a single hybrid array on the same substrate, the patent eliminates the need for complex post-capture alignment between separate sensors. The integrated structure ensures that 2D and 3D data are inherently aligned at the pixel level, as both sensing types occur simultaneously within the same physical sensor array.

Inventive Principle:
Principle #5Merging (Combining)

3Adaptability or versatility

If separate detection systems are used to provide 2D image data and 3D depth data, then detection capability is improved, but computational resources required increase

Engineering Contradiction:
Improvedetection capabilityVSAvoidcomputational complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent merges 2D and 3D sensing at the hardware level, which enables synchronized capture and reduces the computational burden of aligning and fusing data from separate systems. The hybrid array produces coordinated 2D and 3D data streams that require less complex processing and alignment algorithms compared to integrating data from independent sensors.

Inventive Principle:
Principle #5Merging (Combining)

4Length of stationary object

If traditional sensor systems are used, then detection range is limited, but form factor can be reduced

Engineering Contradiction:
Improveform factorVSAvoiddetection range
Core Design Contradiction:
Length of stationary objectVSMeasurement precision

Solution Approach 1:

The patent implements a nested structure where the 3D depth sensing region is integrated within the same substrate as the 2D imaging region. The hybrid sensor array embeds multiple sensing functions at different hierarchical levels, allowing compact form factor while achieving extended detection range through the combined capabilities of both 2D and 3D sensing regions.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent transitions from traditional 2D imaging to a three-dimensional sensing capability by incorporating depth measurement along the Z-axis while maintaining the 2D pixel array structure. This dimensional enhancement allows the compact sensor to provide both wide field of view and extended detection range through 3D depth information.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The hybrid sensing system provides high-resolution 2D and 3D images with improved object detection and tracking capabilities, reducing computational resources and power usage while enhancing detection range and mobility.

Implementation Method 1

detect ambient light reflected from an object

Methodology Applied
Scientific EffectLight reflection: Reflection

Implementation Method 2

metalens being configured to direct the ambient light reflected from the object towards the 2D sensing region

Methodology Applied
Scientific EffectLight refraction: Refraction

Implementation Method 3

2D sensing region configured to detect ambient light reflected from an object and a 3D depth sensing region configured to detect the light emitted by the light source and reflected from the object

Methodology Applied
Scientific EffectPhotoelectric effect: Photoelectric Effect

Data Source

PatentUS11706400B2Hybrid sensor system and method for providing 3D imaging
Publication Date: 2023.07.18 SAMSUNG ELECTRONICS CO LTD
  • US11706400B2 patent drawing
  • US11706400B2 patent drawing
  • US11706400B2 patent drawing

AI summary

Provided is a 3D depth sensing system and method of providing an image based on a hybrid sensing array. The 3D sensing system including a light source configured to emit light, a hybrid sensing array comprising a 2D sensing region configured to detect ambient light reflected from an object and a 3D depth sensing region configured to detect the light emitted by the light source and reflected from the object, a metalens on the hybrid sensing array, the metalens being configured to direct the ambient light reflected from the object towards the 2D sensing region, and to direct the light emitted by the light source and reflected from the object towards the 3D depth sensing region, and a processing circuit configured to combine 2D image information provided by the 2D sensing region and 3D information provided by the 3D depth sensing region to generate a combined 3D image.