Monolithic IC Array Interconnects for Flexible Sensor Manufacturing
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Solution Overview
Problem
The manufacturing of flexible and stretchable integrated circuit arrays for applications like ultrasound imaging systems is complicated due to the complexity of connecting electrical interconnects in a post-processing step, increasing technical effort.
Innovation Solution
The integration of electrical interconnects as metal lines within the integrated circuit elements during the IC process, forming a monolithic structure, allows for a flexible and stretchable connection layer to be coupled with the circuit elements, reducing the need for post-processing electrical connections and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electrical interconnects are connected in a post-processing step, then flexible and stretchable sensor arrays can be manufactured, but the technical effort for manufacturing is increased
Solution Approach 1:
The electrical interconnects are formed as metal lines during the integrated circuit fabrication process itself, before the sensor array is assembled. This preliminary integration eliminates the need for separate post-processing connection steps, reducing manufacturing complexity while maintaining flexibility and stretchability through the monolithic structure design
2Adaptability or versatility
If individual transducer elements are fabricated on silicon wafer and attached to flexible layer, then stretchable CMUT array can be manufactured, but the manufacturing process becomes complex with multiple separate steps
Solution Approach 1:
The patent merges the fabrication of electrical interconnects with the integrated circuit elements into a single monolithic structure formed during the IC process. This combining of previously separate steps (interconnect fabrication and circuit element fabrication) into one integrated process reduces manufacturing complexity while maintaining the stretchable array configuration
3Ease of manufacture
If electrical interconnects are formed as metal lines forming monolithic structure with integrated interconnects, then manufacturing effort is reduced, but the interconnects must be separated from the connection layer
Solution Approach 1:
The patent segments the electrical interconnects from the flexible connection layer, allowing the metal line interconnects to be formed as a monolithic structure with the integrated circuits during fabrication, while the connection layer serves as a separate flexible substrate. This segmentation enables simplified manufacturing through integrated processing while managing structural complexity through functional separation
Data Source
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AI summary
An integrated circuit array, in particular for two dimensional sensor arrays such as ultrasound imaging systems is disclosed. The integrated circuit array (10) comprises a plurality of integrated circuit elements (12) each formed in a substrate (14), wherein the substrates are separated from each other. The array comprises a flexible and / or stretchable connection layer (22) connected to the integrated circuit elements for flexibly connecting the integrated circuit elements to each other. The array further comprises a plurality of electrical interconnects (18) for electrically connecting the integrated circuit elements to each other, wherein the electrical interconnects are formed as metal lines in one piece with integrated interconnects of the integrated circuit elements.