Monolithic IC Package with Integrated Alignment and Thermal Features
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current MEMS spatial light modulator IC packaging technologies face challenges in achieving sufficient structural integrity, thermal connection, and opto-mechanical alignment while minimizing the installed footprint, as composite construction complicates design optimization due to thermal expansion mismatches and principle-member construction results in a larger footprint due to feature dispersion.
Innovation Solution
A monolithic frame device with integrated alignment features, a thermal interface, and an independent electrical interface, allowing for stacked feature placement and front-side cooling, providing structural integrity and flexibility similar to composite construction with minimized alignment tolerances like principle-member designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If composite construction is used to achieve sufficient structural integrity, then structural integrity is improved, but device complexity increases due to multiple piece-parts requiring CTE matching and assembly optimization
Solution Approach 1:
The patent merges multiple separate components (frame, alignment features, electrical interfaces, thermal interfaces) into a single monolithic frame structure. This integration eliminates the need for assembling multiple piece-parts while maintaining structural integrity, directly resolving the contradiction between strength and device complexity.
2Manufacturing precision
If principle-member construction is used to achieve sufficient structural integrity, then alignment precision is improved, but area of package increases due to feature dispersion in the same plane
Solution Approach 1:
The patent transitions from two-dimensional planar feature arrangement to three-dimensional stacked feature placement. Alignment features, electrical interfaces, and thermal interfaces are positioned at different vertical levels (z-axis) within the monolithic frame, enabling compact packaging while maintaining precise alignment through the single-piece construction.
3Area of stationary object
If composite construction is used to minimize package footprint through stacked features, then area of package is reduced, but manufacturing precision deteriorates due to cumulative tolerances across multiple piece-parts
Solution Approach 1:
By consolidating all alignment features, electrical interfaces, and thermal interfaces into a single monolithic frame, the patent eliminates cumulative tolerances that arise from assembling multiple piece-parts. The single-piece construction ensures that all features are precisely positioned relative to each other without tolerance stacking, thereby maintaining manufacturing precision while achieving compact packaging.
Data Source
AI summary
According to various illustrative embodiments of the present invention, a device for an integrated circuit includes a monolithic frame having a plurality of alignment features disposed thereon, the monolithic frame having a mounting surface disposed thereon for the integrated circuit, the monolithic frame also having a thermal interface area disposed thereon for the integrated circuit. The device also includes an electrical interface capable of providing an electrical connection for the integrated circuit, the plurality of alignment features being substantially independent of the electrical interface, and an adhesive layer disposed between the monolithic frame and the electrical interface.