Monolithic LED Array Bonding for Compact Near-Eye Displays

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Solution Overview

Problem

Designing electronic devices with near-eye displays, such as virtual and augmented reality headsets, poses challenges due to bulkiness and suboptimal optical performance and power consumption if components are not carefully managed.

Innovation Solution

The use of a monolithic array of light-emitting diodes (LEDs) with integrated driver circuitry and light redirecting structures on a substrate layer, allowing independent control and optimization of light emission for improved optical performance and power efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If conventional display components are used in near-eye displays, then the device can be manufactured with standard components, but the device becomes bulky and exhibits suboptimal optical performance and power consumption

Engineering Contradiction:
Improvedisplay device volumeVSAvoidoptical performance
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent combines multiple display components into an integrated engine assembly where light-emitting diodes, optical elements, and control circuitry are merged into a single compact unit. This integration eliminates the need for separate bulky components while maintaining optimal optical performance through precise component positioning and coupling.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent employs a nested structure where optical elements are positioned within or around the light-emitting diode array, and control circuitry is integrated within the same housing. This nesting approach maximizes space utilization and reduces the overall volume of the near-eye display device.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Use of energy by stationary object

If conventional display components are used in near-eye displays, then standard manufacturing processes can be employed, but power consumption increases and optical performance deteriorates

Engineering Contradiction:
Improvepower consumptionVSAvoidbrightness uniformity
Core Design Contradiction:
Use of energy by stationary objectVSIllumination intensity

Solution Approach 1:

The patent implements local quality control by using individually addressable light-emitting diodes within the array, allowing different regions to be controlled independently. This enables precise local adjustment of brightness and power consumption, optimizing overall energy efficiency while maintaining uniform illumination across the display area.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent utilizes light-emitting diodes which allow for dynamic parameter changes in brightness and color output. By controlling the electrical parameters of individual LEDs, the system can optimize power consumption while maintaining desired illumination intensity and brightness uniformity across the display.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If light-emitting diodes are independently controlled by driver circuitry, then optical performance and power efficiency are optimized, but device complexity increases

Engineering Contradiction:
Improveoptical performanceVSAvoiddriver circuitry complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent integrates the driver circuitry within the same housing as the light-emitting diode array, creating a unified engine assembly. This merging of control and display functions reduces the number of separate components and simplifies the overall device architecture, thereby reducing complexity while maintaining independent LED control for optimized optical performance.

Inventive Principle:
Principle #5Merging (Combining)

4Illumination intensity

If a monolithic array of light-emitting diodes is used, then light distribution and brightness uniformity are optimized, but manufacturing precision requirements increase

Engineering Contradiction:
Improvebrightness uniformityVSAvoidLED array alignment
Core Design Contradiction:
Illumination intensityVSManufacturing precision

Solution Approach 1:

The patent positions the monolithic LED array within a standardized housing that provides mechanical alignment references. The nested structure ensures that the LED array maintains precise relative positioning with optical elements, reducing manufacturing precision requirements while achieving optimal light distribution and brightness uniformity.

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances optical performance and reduces power consumption by optimizing light distribution and brightness uniformity, enabling high-quality image display with enhanced dynamic range and contrast.

Implementation Method 1

The array of light sources may include a plurality of light-emitting diodes (LEDs)

Methodology Applied
Scientific EffectElectroluminescence: Electroluminescence

Implementation Method 2

The substrate layer may include a plurality of light redirecting structures that redirect light emitted by the array of light sources

Methodology Applied
Scientific EffectTotal internal reflection: Total Internal Reflection

Data Source

PatentUS12538837B2Display systems having monolithic arrays of light-emitting diodes
Publication Date: 2026.01.27 APPLE INC
  • US12538837B2 patent drawing
  • US12538837B2 patent drawing
  • US12538837B2 patent drawing

AI summary

An electronic device may include a display having a monolithic array of light-emitting diodes mounted to a surface of a substrate layer. The diodes may include contact pads. Driver circuitry may independently drive each of the diodes in the array using drive signals. The driver circuitry may be formed on a driver integrated circuit. Bond pads may be formed on a surface of the integrated circuit. Copper pillars may be grown on the bond pads. In another suitable arrangement, the driver circuitry may be formed on a driver printed circuit board coupled to an interposer by a flexible printed circuit. The interposer may include bond pads and copper pillars grown on the bond pads. The contact pads on each of the diodes may be simultaneously bonded to the copper pillars. A surface of the substrate layer may be patterned to form light redirecting elements if desired.