Monolithic LED Chip Series Sub-LEDs High Voltage Low Current
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional LED chips operating at high current and low voltage require expensive and bulky driver circuitry, and achieving high light output in a compact form factor is challenging due to the need for multiple LED packages with 'dead space' between them, limiting the ability to shape the light output effectively.
Innovation Solution
A monolithic LED chip design featuring multiple sub-LEDs connected in series on a single submount, allowing for high voltage and low current operation while maintaining a compact size, with sub-LEDs being densely packed to maximize active emission area and using conductive interconnects and insulating features for efficient light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If multiple LED packages are mounted on a circuit board to achieve high light output, then the total luminous flux increases, but the device size increases and 'dead space' between packages limits compactness
Solution Approach 1:
Multiple LED junctions are integrated onto a single LED chip substrate, merging what would traditionally be separate LED packages into one unified device. This eliminates the dead space between packages while maintaining high total luminous flux through the combined output of multiple junctions on the same chip.
Solution Approach 2:
The patent transitions from a two-dimensional array of separate LED packages on a circuit board to a three-dimensional integration where multiple LED junctions are stacked or arranged vertically on a single chip substrate, effectively utilizing the vertical dimension to pack more light-emitting elements into a smaller footprint.
2Illumination intensity
If single LED chips operate at high current to achieve high light output, then luminous flux increases, but expensive and bulky driver circuitry is required
Solution Approach 1:
The LED chip is divided into multiple independent LED junctions that can be electrically connected in series. This segmentation allows the total luminous flux to be achieved through multiple lower-current junctions rather than one high-current junction, thereby reducing the complexity and size of the required driver circuitry.
Solution Approach 2:
The patent changes the electrical operating parameters by connecting multiple LED junctions in series, which increases the operating voltage while reducing the operating current compared to a single high-power LED junction. This parameter transformation enables the use of simpler, less bulky driver circuitry that is better suited for high-voltage, low-current operation.
3Stress or pressure
If multiple LED packages are used to achieve high voltage operation, then voltage increases, but the number of components and assembly complexity increase
Solution Approach 1:
Multiple LED junctions are integrated onto a single LED chip substrate, merging what would traditionally be separate LED packages into one unified device. This eliminates the dead space between packages while maintaining high total luminous flux through the combined output of multiple junctions on the same chip.
Solution Approach 2:
The LED chip is divided into multiple independent LED junctions that can be electrically connected in series. This segmentation allows the total luminous flux to be achieved through multiple lower-current junctions rather than one high-current junction, thereby reducing the complexity and size of the required driver circuitry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables efficient high voltage and low current operation with reduced driver circuitry size, increased system efficiency, and improved light output in a compact form factor, while also providing fault tolerance and reduced costs per lumen.
Implementation Method 1
Light emitting diodes (LED or LEDs) are solid state devices that convert electric energy to light
Implementation Method 2
a reflective layer on the submount
Data Source
AI summary
A light emitting diode chip includes a submount, a reflective layer on the submount, an insulating layer on the reflective layer opposite the submount, and a plurality of sub-LEDs on the insulating layer. Each of the sub-LEDs includes a first face adjacent to the submount and a transparent contact on the first face between the sub-LED and the insulating layer and electrical interconnects between adjacent ones of the sub-LEDs.


