Monolithic LED Package with Series-Connected LEDs
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Solution Overview
Problem
Conventional LED packages are costly to produce and have suboptimal thermal properties due to inefficient heat management, which reduces their service life and the life of lighting devices.
Innovation Solution
The development of a monolithic light emitting diode (LED) package with a flip chip architecture and a connection substrate featuring metallic landing pads separated by insulating material, where series and parallel electrical connections are formed at the wafer level, enabling efficient thermal transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional LED packages use wired connections from LED to metal substrate and series connections between LEDs, then electrical functionality is achieved, but production cost increases and thermal performance deteriorates
Solution Approach 1:
The patent merges the LED array with the substrate by forming electrical connections directly on the substrate surface during wafer fabrication. Multiple LEDs are interconnected in series through conductive paths etched into the substrate, eliminating the need for separate wire bonding steps. This integration reduces manufacturing complexity and cost while improving thermal management through direct substrate contact.
Solution Approach 2:
The patent performs electrical interconnections between LEDs and to the substrate during the wafer fabrication process itself, before the LEDs are packaged. Conductive paths are formed on the substrate surface during wafer-level processing, enabling subsequent dicing and packaging operations to proceed without additional complex wiring steps, thereby reducing production cost and time.
2Reliability
If conventional LED packages use wired connections from LED to metal substrate, then electrical functionality is achieved, but device complexity increases
Solution Approach 1:
The patent merges the LED array with the substrate by forming electrical connections directly on the substrate surface during wafer fabrication. Multiple LEDs are interconnected in series through conductive paths etched into the substrate, eliminating the need for separate wire bonding steps. This integration reduces manufacturing complexity and cost while improving thermal management through direct substrate contact.
3Power
If conventional LED packages generate large amounts of heat during operation, then LED functionality is maintained, but thermal performance deteriorates and service life reduces
Solution Approach 1:
The patent extracts heat from the LED array by providing direct thermal pathways to the substrate. The substrate is designed with high thermal conductivity materials and incorporates heat sinks or thermal management structures that actively remove heat from the LED junctions during operation, preventing heat accumulation and extending service life.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production costs and enhances thermal performance by allowing for effective heat dissipation during operation, thereby improving the service life of LED packages.
Implementation Method 1
The monolithic chip is mounted onto a connection substrate that includes first and second landing pads which are formed from a metallic material... enabling efficient thermal transfer
Data Source
AI summary
Light emitting diode packages as disclosed herein include a monolithic chip including at least a first and a second light emitting diode (LED) that are electrically coupled in series, wherein the first and the second LEDs each include at least one electrical terminal configured to be electrically coupled to a power source. The monolithic chip is mounted onto a connection substrate having first and second landing pads formed from metallic material and electrically isolated from each other. The monolithic chip is mounted to the connection substrate such that the electrical terminal of the first LED is electrically connected to the first landing pad and the electrical terminal of the second LED is electrically connected to the second landing pad. In an example, the monolithic chip includes a third and a fourth LED electrically coupled to each other in series, and electrically coupled to the first and second LEDs in parallel.