Monolithic MEMS Platform Integrating Pressure, Temperature, and Gas Sensors
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Solution Overview
Problem
Sensor systems with multiple die arranged within a shared package have a large form factor and added complexity and cost due to separate substrates for MEMS devices and CMOS substrates, which are not easily integrated.
Innovation Solution
A monolithic MEMS platform integrating a temperature sensor, pressure sensor, and gas sensor within a shared semiconductor die, featuring a semiconductor substrate with a dielectric layer, a MEMS substrate with doped semiconductor material, and a polymer between gas sensor electrodes, allowing for vertical separation of pressure sensor electrodes and electrical connectivity through TSVs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple die are arranged within a shared package, then sensor functionality is achieved, but form factor increases and manufacturing complexity increases
Solution Approach 1:
The patent merges multiple sensor die (pressure sensor, temperature sensor, gas sensor) into a single monolithic MEMS platform by integrating them on one semiconductor die. This combining approach achieves the desired sensor functionality while reducing the overall form factor compared to arranging multiple separate die in a shared package.
Solution Approach 2:
The patent transitions from a two-dimensional arrangement of multiple die in a shared package to a three-dimensional monolithic integration where sensors are stacked or arranged vertically on a single die. This dimensional change enables compact integration of multiple sensor functions without increasing the planar footprint.
2Adaptability or versatility
If multiple die are arranged within a shared package, then sensor functionality is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines multiple sensor functions into a single monolithic MEMS platform fabricated using standard CMOS processes. This merging eliminates the need for separate fabrication and packaging processes for individual die, thereby reducing manufacturing complexity and cost while maintaining full sensor functionality.
Solution Approach 2:
The monolithic MEMS platform is designed to perform multiple sensor functions (pressure, temperature, gas sensing) within a single device structure. This multi-functionality approach allows one universal platform to replace multiple specialized die, simplifying the manufacturing supply chain and reducing overall system complexity.
3Reliability
If MEMS devices and CMOS substrates are formed on separate substrates, then device functionality is achieved, but integration difficulty increases
Solution Approach 1:
The patent merges MEMS device structures with CMOS substrate integration by forming both on the same semiconductor die. This combining approach maintains the functional integrity of MEMS devices while eliminating the integration challenges associated with bonding and aligning separate MEMS and CMOS substrates.
Solution Approach 2:
The patent uses standard CMOS process technologies as an intermediary platform to fabricate MEMS structures. By utilizing the CMOS substrate as a common foundation for both electronic and mechanical components, the patent eliminates the need for complex substrate bonding and alignment processes, thereby easing manufacturing integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a low-cost sensor system with a small form factor by integrating sensors within a shared die, reducing fabrication and packaging complexity.
Implementation Method 1
A polymer having a dielectric constant that varies depending upon a humidity of a surrounding ambient environment is disposed between the first gas sensor electrode and the second gas sensor electrode
Implementation Method 2
A cavity disposed within an upper surface of the dielectric layer is configured to vertically separate the second pressure sensor electrode from a first pressure sensor electrode to form a MEMS pressure sensor
Data Source
AI summary
The present disclosure is directed to a monolithic MEMS (micro-electromechanical system) platform having a temperature sensor, a pressure sensor and a gas sensor, and an associated method of formation. In some embodiments, the MEMS platform includes a semiconductor substrate having one or more transistor devices and a temperature sensor. A dielectric layer is disposed over the semiconductor substrate. A cavity is disposed within an upper surface of the dielectric layer. A MEMS substrate is arranged onto the upper surface of the dielectric layer and has a first section and a second section. A pressure sensor has a first pressure sensor electrode that is vertically separated by the cavity from a second pressure sensor electrode within the first section of a MEMS substrate. A gas sensor has a polymer disposed between a first gas sensor electrode within the second section of a MEMS substrate and a second gas sensor electrode.