Monolithic Oscillating Heat Pipe for Flexible Conformal Cooling
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Solution Overview
Problem
Conventional oscillating heat pipes are either rigid or require flexible bellows, limiting their adaptability and efficiency in thermal transfer applications.
Innovation Solution
A monolithic, partially flexible oscillating heat pipe device made of materials like silicone or elastomeric polyurethane, with channels and cross-channels for fluid communication, allowing flexible configuration and efficient heat transfer without bellows.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional OHPs are made rigid or use flexible bellows sections, then structural integrity is maintained, but adaptability to complex structures and thermal transfer efficiency are limited
Solution Approach 1:
The patent applies this principle by making the entire heat pipe body flexible rather than using rigid sections with separate bellows. The flexible body can conform to complex structures while maintaining structural integrity through its elastic properties, eliminating the need for separate flexible sections and reducing overall structural complexity.
Solution Approach 2:
The patent merges the flexible bellows section with the evaporator and condenser sections into a single integrated flexible body. This consolidation eliminates the need for separate components and simplifies the overall structure while maintaining the ability to adapt to complex geometries.
2Adaptability or versatility
If flexible bellows sections are inserted between evaporator and condenser, then flexibility is achieved, but thermal transfer efficiency is reduced
Solution Approach 1:
The flexible body is designed with sufficient thermal conductivity to maintain efficient heat transfer while providing the necessary flexibility. The material and geometric design ensure that the flexible sections do not create excessive thermal resistance, allowing the heat pipe to maintain high thermal transfer efficiency despite its flexible nature.
3Temperature
If body thickness is increased to improve thermal conduction, then heat transfer coefficient increases, but flexibility decreases
Solution Approach 1:
The patent optimizes the body thickness parameter to achieve a balance between thermal conduction and flexibility. By carefully selecting the thickness within a specific range, the heat pipe achieves sufficient thermal conductivity for efficient heat transfer while maintaining enough flexibility to conform to complex structures and withstand thermal cycling without failure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves higher heat transfer coefficients and adaptability to complex structures by being flexible and conformal, enhancing thermal management in electrical components.
Implementation Method 1
a heat transfer fluid trapped within the channels to transfer heat between the evaporator portion and the condenser portion
Implementation Method 2
Oscillating heat pipes (OHPs) are passive, two-phase heat transfer devices
Implementation Method 3
The body can be configured to flex at least between the evaporator portion and the condenser portion
Implementation Method 4
effectively transfer large amounts of thermal energy with low thermal resistances
Data Source
AI summary
An oscillating heat pipe device can include a body formed to be at least partially flexible, one or more channels within the body and defined by the body, an evaporator portion within the body at a first end of the one or more channels and in fluid communication with the one or more channels, and a condenser portion within the body at a second end of the one or more channels and in fluid communication with the one or more channels. The body can be configured to flex between the evaporator portion and the condenser portion. The device can include a heat transfer fluid trapped within the channels to transfer heat between the evaporator portion and the condenser portion.


