Monolithic Optical Circuit Substrates Integrating III-V Light Sources

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Solution Overview

Problem

Current silicon-on-insulator (SOI) wafers rely on external light sources for optical circuits, limiting the integration of light sources and photodetectors within the wafer, which hampers the development of high-speed and high-bandwidth optical signal transmission.

Innovation Solution

Incorporating germanium or III-V compounds as a template for growing light sources and photodetectors within the wafer, allowing for the coexistence of these components on the same wafer surface with a silicon waveguide that directs and confines light for optical components like modulators and detectors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If external light sources are used with SOI wafers, then optical circuits can be implemented, but light sources cannot be integrated within the wafer

Engineering Contradiction:
Improveintegration of light sourcesVSAvoidexternal coupling structures
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent merges the light source functionality directly into the wafer structure by integrating III-V material regions that can generate light, eliminating the need for external light sources and their associated coupling structures. This combining of light generation and optical circuit functions within a single integrated device resolves the contradiction between adaptability and device complexity.

Inventive Principle:
Principle #5Merging (Combining)

2Speed

If light transmission is used instead of electrical circuits, then signal transmission speed increases, but integration of optical components within the wafer is limited

Engineering Contradiction:
Improvesignal transmission speedVSAvoidintegration of optical components
Core Design Contradiction:
SpeedVSAdaptability or versatility

Solution Approach 1:

The patent employs composite materials by integrating III-V semiconductor materials (such as InP or GaAs) that emit light at specific wavelengths with the silicon-based SOI wafer structure. This composite approach enables both high-speed optical signal transmission and the integration of light-generating components within the same wafer, simultaneously achieving speed improvement and component adaptability.

Inventive Principle:
Principle #40Composite materials

3Adaptability or versatility

If germanium or III-V compounds are used as templates for growth, then light sources and photodetectors can be integrated within the wafer, but manufacturing complexity increases

Engineering Contradiction:
Improveintegration of light sources and photodetectorsVSAvoidwafer fabrication process
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent applies preliminary action by preparing the germanium or III-V compound template layers on the SOI wafer before integrating the light sources and photodetectors. This pre-preparation of lattice-matched template structures simplifies the subsequent growth and integration processes, making the manufacturing of integrated optical components more manageable despite the increased complexity.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the integration of both light sources and photodetectors within the same wafer, enhancing signal transmission speed and bandwidth by allowing light to be propagated internally, reducing signal delay and increasing the efficiency of optical circuitry.

Implementation Method 1

Light that is not far from parallel to the boundary between the two materials is trapped inside the N1 material because of total internal reflection

Methodology Applied
Scientific EffectTotal internal reflection: Total Internal Reflection

Implementation Method 2

use germanium, or another lattice material compatible with III-V compounds, or a suitable III-V compound, as a template for growth of, on the one hand, further germanium or a compound of Group III and Group V

Methodology Applied
Scientific EffectEpitaxy: Epitaxy

Data Source

PatentUS8299485B2Substrates for monolithic optical circuits and electronic circuits
Publication Date: 2012.10.30 SOITEC SA
  • US8299485B2 patent drawing
  • US8299485B2 patent drawing
  • US8299485B2 patent drawing

AI summary

A multilayer wafer structure containing a silicon layer that contains at least one waveguide, an insulating layer and a layer that is lattice compatible with Group III-V compounds, with the lattice compatible layer in contact with one face of the insulating layer, and the face of the insulating layer opposite the lattice compatible layer is in contact with the silicon layer. The silicon and insulating layers contain either or both of at least one continuous cavity filled with materials such as to constitute a photodetector zone, or at least one continuous cavity filled with materials such as to constitute a light source zone.