Monolithic Optoelectronic Chip Integrating Waveguides and Electro-Optical Components
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Solution Overview
Problem
Current optical transceiver devices face challenges in achieving a compact, energy-efficient, and cost-effective design with low electrical and optical losses, particularly due to long signal paths and coupling losses in existing packaging solutions, which hinder scalability and reserve power for transmission medium losses.
Innovation Solution
The optoelectronic component features a chip with optical connections on top and electrical connections on the underside, utilizing a printed circuit board as a wiring plane and incorporating monolithically integrated electro-optical components like photodetectors and modulators, along with deflection devices such as grating couplers, to minimize signal attenuation and facilitate efficient scalability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discrete optical components are placed on a carrier substrate using wire bonding or flip chip, then electrical connections are established, but signal paths become long causing attenuation losses and coupling losses
Solution Approach 1:
The patent combines electrical connections and optical connections on the same chip substrate, eliminating the need for separate carrier substrates and wire bonding. The electrical conductor tracks are directly formed on the chip, and optical waveguides are integrated into the same substrate, reducing the number of interfaces and coupling points that cause signal loss.
Solution Approach 2:
The chip substrate itself acts as an intermediary that integrates both electrical and optical functions. Instead of using separate carrier substrates and bonding wires, the chip provides direct pathways for both electrical signals and optical signals, reducing the number of intermediate coupling points.
2Adaptability or versatility
If multiple discrete components are integrated on a common substrate, then functionality is increased, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges optical components (waveguides, light sources, photodetectors) and electrical components (conductor tracks, contact pads) into a single integrated chip structure. This consolidation reduces the number of separate packages and assembly steps while maintaining full transceiver functionality.
Solution Approach 2:
The chip substrate serves multiple functions simultaneously: it provides mechanical support, electrical conduction pathways, optical waveguide pathways, and mounting surfaces for optical fibers. This multi-functionality reduces the need for separate specialized substrates for each function.
3Loss of energy
If optical connections are arranged on the top of the chip and electrical connections on the underside, then signal path length is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent implements different connection configurations at different locations on the chip: optical connections are positioned on the top surface where they can directly interface with optical fibers, while electrical connections are positioned on the underside for PCB mounting. This localized optimization reduces signal path length for optical signals while maintaining ease of electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces signal attenuation, enables efficient scalability, and maintains a simple and cost-effective structure for optical transceiver devices, addressing the limitations of existing packaging technologies by optimizing the placement and connection of optical and electrical components.
Implementation Method 1
The integrated waveguide is preferably equipped with a deflection device or is connected to one that deflects optical radiation to be coupled out from the waveguide almost perpendicularly towards the top of the chip
Implementation Method 2
The monolithically integrated electro-optical component is preferably a photodetector or a modulator
Implementation Method 3
A modulator, which modulates the radiation from the light source before it is coupled into the optical fiber
Data Source
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AI summary
The invention relates to an optoelectronic component (100) comprising a chip (110) with a substrate (12) and at least one optical waveguide (20) integrated in the chip (110). According to a variant of the invention, an electro-optical component (30) is monolithically integrated into one or more semiconductor layers of the chip (110) which is arranged on the upper side (12a) of the substrate (12), or on the upper side (12a) of the substrate (12), and at least one electrical connection of the monolithically integrated electro-optical component (30) is connected by means of a connecting line (41) to a conductor connection (43) which is arranged below the lower side of the substrate (12b). The connection line (41) extends through a through hole (42) in the substrate (12) from the electro-optical component (30) to the conductor connection (43) arranged on the lower side of the substrate (12b).