Monolithic Optoelectronic Semiconductor Body with Segmented Sub-segments
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Solution Overview
Problem
Existing optoelectronic semiconductor bodies for lighting applications face challenges in achieving high luminous efficacy with uniform light emission and scalability, requiring improved efficiency and control flexibility compared to conventional lighting means.
Innovation Solution
A monolithic optoelectronic semiconductor body with a semiconductor layer sequence divided into electrically insulated sub-segments, featuring a series connection via additional line levels and contacts, allowing for low current operation and individual control of sub-segments, while maintaining uniform radiation characteristics by routing contacts away from the main emission side.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional lighting means are used, then high luminous efficacy can be achieved, but control flexibility and scalability are limited
Solution Approach 1:
The semiconductor layer sequence is divided into multiple sub-segments that are electrically insulated from one another, allowing independent control of each sub-segment. This segmentation enables flexible lighting patterns and scalability while maintaining a relatively simple driver stage architecture through the series connection approach.
2Illumination intensity
If high current is used to increase light intensity, then luminous efficacy improves, but heat generation and energy loss increase
Solution Approach 1:
The patent implements dynamic control of light intensity by selectively activating different sub-segments through the series connection architecture. Instead of using high current for all segments, the system can dynamically adjust which sub-segments are active, maintaining required illumination intensity while reducing overall energy loss and heat generation.
3Ease of manufacture
If contacts are arranged on the main emission side, then electrical connection is simplified, but radiation characteristics and light uniformity deteriorate
Solution Approach 1:
The patent resolves the conflict by moving the contact arrangement to the opposite side of the semiconductor layer sequence from the main emission side. This dimensional repositioning allows electrical connections to be made without interfering with the light emission path, thereby maintaining manufacturing simplicity while ensuring uniform radiation characteristics and undisturbed light uniformity.
4Adaptability or versatility
If individual control of sub-segments is implemented, then scalability and control flexibility improve, but device complexity increases
Solution Approach 1:
The patent combines multiple sub-segments into a series connection architecture where a single current path flows through all sub-segments. This merging approach allows individual control capability for scalability while avoiding the complexity of multiple independent control circuits, as the series connection naturally provides both individual and collective control options.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables efficient, scalable, and uniformly distributed light emission with reduced current flow and increased voltage drop, allowing for variable luminous efficacy and simplified driver stages, suitable for applications like headlights.
Implementation Method 1
an active layer (22, 322, 615) suitable for generating electromagnetic radiation (400, 605)
Data Source
Figure 1
Figure 2A~2B
Figure 3
AI summary
The invention relates to an optoelectronic semi-conductor body comprising a semi-conductor layer sequence that is divided into at least two electrically insulated part segments. In each part area, the semi-conductor layer sequence comprises an active layer. Also, at least three electric contact pads are provided. One first conductor plane contacts the first of the at least two part segments and the first contact pad. A second conductor plane contacts the second of the at least two part segments and a second contact pad. A third conductor plane joins both part segments together and contacts the third contact pad. Also, the conductor planes are respectively arranged opposite a first main side and said first main side is provided for the emission of generated electromagnetic radiation.