Monolithic Optoelectronic Substrate Integrating Electronic Circuits
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Solution Overview
Problem
Current optoelectronic devices with light-emitting diodes face challenges in reducing size, simplifying manufacturing, and achieving high resolution due to bulk electronic circuits and the need for separate substrates, which increase costs and compromise pixel size.
Innovation Solution
An optoelectronic device with a monolithic substrate where light-emitting diodes are electrically associated and integrated with electronic components on the same substrate, using a conductive substrate for electrodes and insulated conductive means to connect electronic components, allowing for compact pixel design and simplified manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic circuits are manufactured on a separate second substrate using hybridization technique, then the optoelectronic device can be assembled with electronic control circuits, but the bulk due to electronic circuits becomes significant and manufacturing cost increases
Solution Approach 1:
The patent merges the electronic circuit substrate and the light-emitting diode substrate into a single integrated substrate. The electronic control circuits are manufactured directly on the same substrate that carries the light-emitting diodes, eliminating the need for separate substrates and hybridization assembly. This combining approach reduces the overall bulk and volume of the optoelectronic device while maintaining full functionality of both the light-emitting diodes and the electronic control circuits.
2Adaptability or versatility
If electronic circuits are manufactured on a separate second substrate, then the optoelectronic device can be assembled with electronic control circuits, but the manufacturing cost increases due to additional steps
Solution Approach 1:
The patent combines the manufacturing processes for electronic circuits and light-emitting diodes into a single integrated fabrication process on one substrate. This eliminates the need for separate substrate preparation, circuit fabrication, and hybridization assembly steps. The unified manufacturing approach reduces process complexity, minimizes the number of manufacturing steps, and lowers overall production costs while achieving full integration of electronic control circuits with the light-emitting diodes.
3Ease of manufacture
If electronic circuits are integrated on the face of the substrate carrying light-emitting diodes, then manufacturing is simplified, but significant space is lost on the side of the light-emitting diodes
Solution Approach 1:
The patent utilizes the third dimension (vertical depth) of the substrate to resolve the space conflict. Electronic circuits are integrated in the lower portion of the substrate while light-emitting diodes are positioned in the upper portion, creating a vertical stratification of functions. This three-dimensional arrangement allows both electronic circuits and light-emitting diodes to coexist on the same substrate without significant horizontal space loss, as they occupy different vertical zones within the substrate thickness.
4Volume of moving object
If the optoelectronic device uses a monolithic substrate with integrated electronic components, then device size is reduced and pixel density is increased, but the substrate must support both light-emitting diodes and electronic circuits
Solution Approach 1:
The patent creates a universal substrate that performs multiple functions simultaneously. The monolithic substrate serves as both the structural base for light-emitting diodes and the fabrication platform for electronic control circuits. By designing the substrate with multi-functional capabilities, it can accommodate different regions optimized for light emission and electronic circuit operation, enabling size reduction and increased pixel density while maintaining the necessary functionality for both optical and electronic operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the size of the device, lowers manufacturing costs, and enables higher pixel density and resolution by integrating electronic components directly on the substrate, eliminating the need for separate substrates and hybridization techniques.
Implementation Method 1
an optoelectronic device with light-emitting diodes makes it possible to convert an electrical signal into electromagnetic radiation
Implementation Method 2
light-emitting diodes based on semiconductor materials comprising a stack of semiconductor layers or three-dimensional elements mainly comprising at least one group III element and one group V element
Implementation Method 3
The obtaining of the sub-pixels emitting in the two other colors being obtained by means of color converters
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
An optoelectronic device (10) comprises a substrate (11) and a plurality of assemblies (Di) of light-emitting diodes (DELi) where each assembly (Di) comprises a plurality of light-emitting diodes (DELi), a first lower electrode, a second upper electrode, an electronic component of an electronic circuit (16i) formed in a first portion (14i, 14'i) of substrate (11), on the side of the face (13) of the substrate (11) not bearing the light-emitting diodes, and a first conductive means formed passing through the first portion (14i, 14'i) and electrically connecting a first terminal of the electronic component to one of the first and second electrodes. The first conducting means of a given assembly (Di) is electrically insulated from the first conductive means of the other assemblies (Di).