Monolithic Passive Component Package With Shared Common Terminal
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Solution Overview
Problem
Current surface mount passive components require substantial space due to design and manufacturing constraints, limiting component density in packaged ICs, especially when multiple components share a common connection, necessitating separate placement to prevent solder bridges and interference during manufacturing.
Innovation Solution
Integrating multiple passive components into a single monolithic package with a substrate and contact pads, where passive components are electrically connected through a common terminal, allowing for increased density without increasing packaging size, achieved through a method involving printing processes, stacking, and pressing operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple passive components are placed separately on the substrate, then manufacturing reliability is improved (preventing solder bridges), but component density deteriorates (requiring substantial space)
Solution Approach 1:
The patent combines multiple passive components (first passive component and second passive component) into a single integrated package structure. The components share a common substrate and utilize a common terminal (third terminal) that serves as a shared connection point, thereby merging what would traditionally be separate discrete components into one unified package. This merging increases component density while maintaining manufacturing reliability through the shared common terminal design.
2Quantity of substance
If passive components share a common connection point, then component density is improved (reducing space requirements), but manufacturing complexity worsens (design and manufacturing constraints)
Solution Approach 1:
The integrated passive component package is segmented into distinct functional regions: a common substrate, first passive component, second passive component, first terminal, second terminal, and third terminal. The segmentation is achieved through layered construction where different functional elements are formed on separate layers and then stacked together. This segmentation allows each component to be manufactured independently using printing processes on separate layers, reducing overall manufacturing complexity while maintaining high component density.
Solution Approach 2:
The patent transitions from planar arrangement of passive components to a three-dimensional stacked structure. Multiple passive components are arranged vertically on top of each other on the substrate, utilizing the vertical dimension rather than only horizontal spacing. This dimensional change allows components to share common connection points without requiring horizontal separation, thereby increasing component density while simplifying the manufacturing process through standardized stacking operations.
3Quantity of substance
If packaging size is reduced to increase component density, then component density is improved, but spacing requirements between components worsen (design constraints)
Solution Approach 1:
The patent employs vertical stacking of passive components on the substrate, transitioning from two-dimensional planar arrangement to three-dimensional configuration. The first passive component and second passive component are positioned at different vertical levels, allowing them to share common connection points without requiring horizontal spacing. This dimensional change enables reduced packaging size while maintaining adequate spacing through the vertical dimension, thereby increasing component density.
Solution Approach 2:
The patent implements a nested structure where passive components are arranged in a hierarchical configuration on the substrate. The components are positioned such that they can be vertically stacked or nested within the same footprint area, with lower components serving as foundations for upper components. This nesting approach allows multiple components to occupy the same horizontal space at different vertical levels, reducing overall packaging size while maintaining manufacturing spacing requirements.
Data Source
AI summary
A data storage device includes a substrate including a number of contact pads and a number of passive component packages coupled to the contact pads. The data storage device further includes a memory controller coupled to the substrate, and one or more NAND die stacks coupled to the substrate and in electrical communication with the memory controller. One or more of the passive component packages include a first passive component, a second passive component electrically connected to the first passive component, and a first terminal coupled to the first passive component. The passive component packages further include a second terminal coupled to the second passive component, and a third terminal coupled to a common node of the first passive component and the second passive component.