Monolithic Power Module Resin Bonding for EV Cooling
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Solution Overview
Problem
Current power electronics systems for electric vehicles face challenges in efficiently converting direct current from traction batteries to alternating current for electric machines while maintaining compactness and cooling efficiency.
Innovation Solution
A power electronics assembly with a monolithic power module formed by bonding transistor-based switching arrangements and coolant-chamber cores together using resin, integrated into a case, and a method of forming this assembly through injection molding with dissolvable cores to create internal coolant chambers and a manifold for efficient heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If power stages are bonded together via resin to form a monolithic power module, then compactness and structural integration are improved, but manufacturing complexity and assembly difficulty increase
Solution Approach 1:
The patent applies preliminary action by pre-attaching coolant-chamber cores to power stages before final assembly, and using injection molding to pre-integrate multiple components into subassemblies. This reduces the complexity of final assembly while achieving compact monolithic integration, as components are prepared and partially assembled in advance rather than assembled from scratch during final assembly.
2Temperature
If coolant-chamber cores are interleaved with power stages in a linear stack, then cooling efficiency is improved, but manufacturing process complexity increases
Solution Approach 1:
The patent merges the cooling function directly into the power module structure by interleaving coolant-chamber cores with power stages in a linear stack. This integration achieves efficient heat management while the entire assembly is captured in a single injection molding operation, simplifying the manufacturing process despite the complex internal geometry.
Solution Approach 2:
The resin material serves as an intermediary that bonds the coolant-chamber cores to the power stages, creating a unified monolithic structure. This intermediary material facilitates the integration of cooling channels within the power module while maintaining structural integrity and enabling efficient heat transfer from the power stages.
3Stability of the object's composition
If resin is used to bond power stages and coolant-chamber cores, then structural integration and compactness are improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent utilizes parameter changes in the resin material, specifically its transition from a liquid state during injection molding to a solid state upon curing. This phase change allows the resin to flow into and fill all interstices between power stages and coolant-chamber cores, ensuring complete coverage and strong bonding while reducing sensitivity to manufacturing tolerances during the assembly process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient conversion of DC to AC power while providing a compact and effective cooling system, enhancing the performance and reliability of electric vehicle power electronics.
Implementation Method 1
bonding transistor-based switching arrangements and coolant-chamber cores together using resin
Implementation Method 2
circulating a solvent through the power module to dissolve the coolant-chamber and manifold cores
Data Source
AI summary
A power electronics assembly includes a case and an array of power stages disposed within the case. Each of the power stages includes a transistor-based switching arrangement configured to change direct current from a traction battery to alternating current for an electric machine. The power stages are bonded together via a resin to form a monolithic power module adhered to a wall of the case. This disclosure also discloses methods for forming power electronic assemblies.