Monolithic Power Splitter for Differential Signals
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Solution Overview
Problem
Conventional power splitters for differential signals, implemented using two discrete chips, face challenges such as unequal transmission impedance, signal interference, large PCB space occupation, and reduced signal quality due to crossed PCB-routing and differing electrical characteristics.
Innovation Solution
A monolithic power splitter integrates two one-by-two power splitters into a single chip, ensuring equal transmission impedance and reduced PCB space, achieved by manufacturing both splitters on the same or opposite surfaces of a substrate using a uniform process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If two separate one-by-two power splitters are used in discrete chips, then the power splitter can be implemented, but the transmission impedance becomes unequal and signal interference occurs
Solution Approach 1:
The patent combines two separate one-by-two power splitters into a single monolithic power splitter chip. By integrating all four power splitting functions into one chip, the transmission lines are manufactured simultaneously on the same substrate, ensuring equal transmission impedance and eliminating signal interference between separate chips. This resolves the contradiction by merging discrete components into a unified structure.
Solution Approach 2:
The monolithic power splitter chip performs multiple functions: it splits differential signals into four separate output signals while maintaining equal transmission impedance for all paths. The single chip universally handles both signal splitting and impedance matching functions that were previously requiring separate discrete components, thereby improving reliability without sacrificing manufacturing precision.
2Productivity
If two discrete chips are used, then the power splitting function is achieved, but the PCB space occupation increases
Solution Approach 1:
The patent merges two discrete power splitter chips into one monolithic chip, directly reducing the number of components on the PCB. This consolidation eliminates the need for separate chip mounting areas, inter-chip routing spaces, and associated connectors, thereby significantly reducing PCB space occupation while maintaining signal transmission efficiency.
3Ease of operation
If crossed PCB-routing is used for discrete chips, then signal transmission is achieved, but signal interference increases and quality decreases
Solution Approach 1:
By integrating all transmission paths within a single monolithic chip, the patent eliminates the need for crossed PCB-routing entirely. All signal transmission occurs through internally fabricated lines on the same substrate, removing the source of signal interference and quality degradation associated with external PCB routing.
4Adaptability or versatility
If two separate chips are used, then the power splitter can be implemented, but the electrical characteristics differ between chips
Solution Approach 1:
The patent merges the functionality of two separate chips into one monolithic structure, ensuring that all transmission lines are fabricated using the same manufacturing process on the same substrate. This guarantees identical electrical characteristics across all signal paths, eliminating the variability inherent in using separate chips while simplifying the overall device configuration.
Data Source
AI summary
A monolithic power splitter is used to split a pair of input differential signals into two pairs of output differential signals in the present invention. The monolithic power splitter has two input terminals to receive a pair of input differential signals, and it has two one-by-two power splitters integrated in one single chip to split a pair of input differential signals into two pairs of output differential signals with equal power. And, the monolithic power splitter has four output terminals to output two pairs of output differential signals. In one embodiment, the first one-by-two power splitter and the second one-by-two power splitter are made on the same surface of the substrate. In another embodiment, the first one-by-two power splitter and the second one-by-two power splitter are made on opposite surfaces of the substrate. The monolithic power splitter can be used as a power combiner based on the reciprocal property of the power splitter circuit.