Monolithic PTC Ceramic Contact Structure for Faster Heat Transfer
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Solution Overview
Problem
State-of-the-art PTC heating modules in electric vehicles face challenges in thermal and electrical optimization, with thermal conductivity being poor due to inhomogeneous heat distribution and material inhomogeneities, leading to slow heat transfer and potential overheating.
Innovation Solution
A monolithic functional ceramic element is produced by applying metal paste in comb-shaped structures on a thin PTC ceramic film, sandwiched between ceramic substrate films, which are then sintered together to form a layered structure with improved thermal and electrical conductivity, eliminating assembly defects and enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a substrate is used to support the conductor track and decouple heat, then thermal decoupling is improved, but thermal conductivity from the PTC to the decoupling surface deteriorates
Solution Approach 1:
The patent merges the substrate and PTC element into a monolithic structure where the PTC ceramic layer is directly integrated with the substrate layers. This eliminates the need for separate conductor tracks and adhesive layers, creating direct thermal and electrical contact between the PTC and substrate, thereby improving heat transfer speed while maintaining thermal decoupling through the substrate's inherent properties.
Solution Approach 2:
The patent extracts and eliminates the conductor track layer and adhesive layer from the traditional multi-layer structure. By removing these intermediate layers, the thermal path from the PTC element to the substrate is shortened, improving thermal conductivity without compromising the substrate's heat decoupling function.
2Reliability
If conventional multi-layer structure with conductor tracks is used, then electrical insulation is improved, but manufacturing complexity and assembly defects increase
Solution Approach 1:
The patent combines multiple functions into the substrate layers themselves. The substrate layers provide both mechanical support and electrical insulation, while the PTC ceramic layer provides both heating function and electrical resistance. This integration eliminates the need for separate conductor tracks and reduces assembly steps, thereby reducing manufacturing complexity while maintaining electrical insulation through the substrate's layered structure.
3Stability of the object's composition
If PTC ceramic with low thermal conductivity is used, then material homogeneity is maintained, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent creates a composite structure consisting of PTC ceramic layer integrated with substrate layers. The substrate layers have higher thermal conductivity than the PTC ceramic, forming a composite material system that combines the PTC's homogeneous composition with the substrate's superior heat dissipation properties. This composite structure enables efficient heat transfer from the PTC element to the substrate while maintaining the PTC ceramic's material homogeneity and functional properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The monolithic structure ensures homogeneous electric field distribution, reduces energy consumption, minimizes inrush current, and increases thermal coupling, resulting in efficient heat transfer and improved reliability of the heating module.
Implementation Method 1
The layer stack is sintered together to form the functional ceramic element
Implementation Method 2
The PTC element itself acts as a heat source when Joule heat is generated by energization
Implementation Method 3
Heat must travel from the point of origin (the PTC) via the contacting and through the substrate to the decoupling surface
Data Source
AI summary
In embodiments a method for providing a contacting for a functional ceramic element includes providing a functional ceramic, applying a metal paste to two opposing surfaces of the functional ceramic, laminating ceramic substrate green films on the metal paste on the two opposite surfaces of the functional ceramic, and jointly sintering the functional ceramic, the ceramic substrate green films forming electrically insulating ceramic layers and the metal paste forming electrically conductive metal structures.