Monolithic RC Component With Corrugated Contacts for Voltage Spikes
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Solution Overview
Problem
Existing resistor-capacitor components for high-voltage applications suffer from low integration density, significant parasitic inductance, and excessive heating due to high-voltage spikes, limiting their ability to withstand high-frequency switching.
Innovation Solution
A monolithic resistor-capacitor component with corrugated contact holes and edges, utilizing the intrinsic resistivity of the top electrode, allows for high integration density and flexible resistance tuning, reducing current density concentrations and local heating through optimized contact geometry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If discrete resistor and capacitor are soldered onto a printed circuit board, then the component can be easily manufactured and assembled, but the integration density is low and parasitic inductance is significant
Solution Approach 1:
The patent merges the resistor and capacitor into a single integrated component structure. The capacitor comprises a first electrode structure, a second electrode structure, and a dielectric structure between them. The second electrode structure serves dual purposes: as part of the capacitor and as an intrinsic resistor through its material resistivity. This integration eliminates the need for separate discrete components and their connections, thereby increasing integration density while maintaining manufacturability through standard semiconductor processes.
Solution Approach 2:
The second electrode structure performs multiple functions simultaneously: it acts as one of the capacitor electrodes and also provides the resistive function through its intrinsic resistivity. Additionally, the insulating layer with contact holes provides both electrical isolation and controlled resistance tuning. This multi-functionality reduces the number of separate components needed, resolving the contradiction between ease of manufacture and integration density.
2Ease of manufacture
If discrete resistor and capacitor are soldered onto a printed circuit board, then the component can be easily manufactured and assembled, but the parasitic inductance is significant
Solution Approach 1:
By merging the resistor and capacitor into a single monolithic structure with direct internal connections, the patent eliminates the external solder joints and trace inductances inherent in discrete component assemblies. The conductive layer filling the contact holes provides direct electrical connection between the second electrode structure and external terminals, minimizing the loop area and thus reducing parasitic inductance while maintaining ease of manufacture through standard semiconductor fabrication.
3Reliability
If the resistor-capacitor component is used to damp voltage spikes, then the voltage spikes are mitigated, but the component experiences heating that limits its lifetime
Solution Approach 1:
The patent applies local quality by creating non-uniform current distribution through the corrugated contact holes. The corrugations concentrate current flow in specific regions of the second electrode structure, allowing the resistive heating to be localized rather than distributed throughout the entire component. This enables better thermal management and reduces the maximum temperature reached, thereby improving reliability under voltage spike conditions.
Solution Approach 2:
The corrugated contact holes introduce curved surfaces instead of flat contacts. This curvature increases the surface area of the contact interface between the conductive layer and the second electrode structure, distributing the current flow more evenly and reducing current density hotspots. The curved geometry also facilitates heat dissipation by increasing the effective heat transfer surface area, thus reducing component heating while maintaining voltage spike mitigation capability.
4Adaptability or versatility
If the resistance value is tuned by adjusting contact hole parameters, then the resistance can be flexibly controlled, but the manufacturing precision requirements increase
Solution Approach 1:
The patent enables resistance tuning by changing geometric parameters of the contact holes (number, area, shape) rather than changing material properties. This allows continuous adjustment of the resistance value by modifying the contact hole configuration during the manufacturing process. The use of standard photolithography and etching processes to define these geometric parameters maintains manufacturing precision while providing great flexibility in resistance control, as these are routine capabilities in semiconductor fabrication.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed component achieves reduced heating and increased capability to withstand higher voltage spikes, enhancing reliability and lifetime while maintaining high integration density and performance.
Implementation Method 1
the resistance of the proposed component results from the intrinsic resistivity of the second electrode structure
Implementation Method 2
a conductive layer on the insulating layer and filling said one or more contact holes to form one or more electrical contacts with the second electrode structure
Implementation Method 3
the maximum temperature reached by the resistor-capacitor component during operation is located on the edges of these contacts
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 2C
AI summary
The proposed resistor-capacitor component (200) comprises: - a capacitor comprising at least a first electrode structure (210) and a second electrode structure (230) separated by a dielectric structure (220); - an insulating layer (240) on the second electrode structure (230), the insulating layer (240) comprising contact holes (241) distributed across a surface of the insulating layer (240), each of the contact holes (241) delimiting an opening onto the second electrode structure (230) having a corrugated edge; and - a conductive layer (250) on the insulating layer (240) and filling the contact holes (241) to form electrical contacts (251) with the second electrode structure (230).