Monolithic RF Front End Module Single Crystal Acoustic Filters

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Solution Overview

Problem

Conventional RF Front End modules in mobile devices face challenges due to the assembly of multiple discrete die level components, leading to electrical connection losses, increased complexity, size, and cost.

Innovation Solution

The integration of passive and active electronic devices into a monolithic single chip using single crystal epitaxial layers, forming a monolithic epitaxial stack that includes components like filters, amplifiers, and switches, reducing the need for discrete components and wire bonds.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple discrete die level components are assembled to form RF Front End modules, then device functionality is achieved, but electrical connection losses increase and assembly complexity increases

Engineering Contradiction:

Improveelectrical connection performanceVSAvoidassembly complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges multiple discrete die-level components (filters, amplifiers, switches) into a single monolithic integrated circuit chip. This consolidation eliminates the need for wire bonds and interconnections between separate components, directly resolving the technical contradiction by removing electrical connection losses while reducing assembly complexity to a single integrated unit.

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If multiple discrete die level components are assembled, then device functionality is achieved, but device size increases

Engineering Contradiction:

Improvedevice performanceVSAvoidmodule size

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

By combining multiple discrete components into one monolithic IC chip, the patent dramatically reduces the overall device footprint. The integrated architecture eliminates the space required for separate components, wire bonds, and interconnections, directly addressing the contradiction between maintaining device performance and reducing module size.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If multiple discrete die level components are assembled, then device functionality is achieved, but manufacturing cost increases

Engineering Contradiction:

Improvesignal qualityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent consolidates multiple discrete components into a single monolithic integrated circuit, eliminating the need for complex assembly processes including wire bonding, component mounting, and interconnection testing. This integration directly reduces manufacturing cost while maintaining or improving signal quality by eliminating connection losses.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The monolithic IC chip performs multiple functions (filtering, amplification, switching) within a single device, replacing what previously required multiple specialized discrete components. This multi-functionality approach reduces both the bill of materials cost and assembly complexity, directly addressing the manufacturing cost contradiction.

Inventive Principle:

Principle #6Universality (Multi-functionality)

4Ease of operation

If discrete components are used with wire bonds, then electrical connections are established, but signal loss increases

Engineering Contradiction:

Improveelectrical connectivityVSAvoidsignal loss

Core Design Contradiction:

Ease of operationVSLoss of energy

Solution Approach 1:

By integrating all components onto a single monolithic chip, the patent eliminates wire bonds and interconnections between discrete components. The internal connections within the integrated circuit have significantly lower impedance and parasitic effects, directly reducing signal loss while maintaining electrical connectivity.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in a smaller, more cost-effective device with improved performance through optimal impedance match and reduced signal loss, and less assembly variability, enabling faster time to market.

Implementation Method 1

single crystal acoustic resonator devices

Methodology Applied

Scientific EffectAcoustic resonance: Resonance

Implementation Method 2

single crystal acoustic resonator devices

Methodology Applied

Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS11581306B2Monolithic single chip integrated radio frequency front end module configured with single crystal acoustic filter devices

Publication Date: 2023.02.14 AKOUSTIS TECHNOLOGIES CORP

AI summary

A method of manufacture and structure for a monolithic single chip single crystal device. The method can include forming a first single crystal epitaxial layer overlying the substrate and forming one or more second single crystal epitaxial layers overlying the first single crystal epitaxial layer. The first single crystal epitaxial layer and the one or more second single crystal epitaxial layers can be processed to form one or more active or passive device components. Through this process, the resulting device includes a monolithic epitaxial stack integrating multiple circuit functions.