Monolithic Semiconductor Chip Integration with Compound Material
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Solution Overview
Problem
Current semiconductor devices face challenges in enhancing thermal and electrical performance, particularly in the design and arrangement of multiple semiconductor chips, which affects the overall performance of the device.
Innovation Solution
The solution involves a device configuration with a first semiconductor chip arranged over a carrier and encapsulated with a laminate, where a second semiconductor chip is integrated over another carrier embedded within the laminate, enabling electrical coupling between the chips through conductive elements, and the use of compound semiconductor materials for improved performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor chips are arranged in a device, then functional capability is improved, but thermal management becomes more difficult
Solution Approach 1:
The patent transitions from planar arrangement to three-dimensional stacking of semiconductor chips. Multiple chips are arranged vertically in different layers (first chip in first layer, second chip in second layer), utilizing the vertical dimension to increase functional capability while maintaining effective thermal management through dedicated heat dissipation paths for each layer.
Solution Approach 2:
The device is segmented into multiple independent layers, with each semiconductor chip mounted on its own carrier substrate. The first semiconductor chip is mounted on a first carrier substrate, and the second semiconductor chip is mounted on a second carrier substrate, allowing independent thermal management for each chip while maintaining overall device functionality.
2Adaptability or versatility
If multiple semiconductor chips are arranged in a device, then functional capability is improved, but electrical connection complexity increases
Solution Approach 1:
Carrier substrates are introduced as intermediary elements between semiconductor chips. The first semiconductor chip is electrically connected to the second semiconductor chip through conductive structures formed on the carrier substrates, simplifying the electrical connection architecture compared to direct chip-to-chip connections.
Solution Approach 2:
Electrical connections are established through the vertical stacking architecture. Conductive structures extend vertically through the layered structure, enabling electrical connectivity between chips in different layers without requiring complex lateral routing, thus reducing connection complexity despite increased functional capability.
3Area of stationary object
If semiconductor chips are closely arranged, then device area is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The patent utilizes vertical stacking to reduce the horizontal footprint of the device. By arranging semiconductor chips in multiple layers (first layer and second layer) rather than spreading them out in a single plane, the device achieves compact area while maintaining effective heat dissipation through vertical thermal pathways.
Solution Approach 2:
Each semiconductor chip is mounted on its own carrier substrate, creating segmented thermal zones. The first semiconductor chip and second semiconductor chip are thermally managed independently through their respective carrier substrates, allowing efficient heat dissipation despite close spatial arrangement in the vertical dimension.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances thermal and electrical performance by allowing efficient electrical coupling and heat dissipation between semiconductor chips, improving the operational efficiency of the device.
Implementation Method 1
the second semiconductor material comprises a compound semiconductor
Implementation Method 2
enhances thermal and electrical performance by allowing efficient electrical coupling and heat dissipation
Data Source
AI summary
A device includes a driver circuit, a first semiconductor chip monolithically integrated with the driver circuit in a first semiconductor material, and a second semiconductor chip integrated in a second semiconductor material. The second semiconductor material is a compound semiconductor.