Monolithic Semiconductor Laser 3D Scanner Module
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing 3D scanners are either bulky or costly, and they lack the precision needed for capturing detailed three-dimensional shapes of objects effectively.
Innovation Solution
A compact 3D scanner module utilizing a monolithic semiconductor laser component that integrates both the primary beam source and optical detector array, including a VCSEL Doppler sensor, for precise distance and velocity measurements, allowing for high-precision three-dimensional data capture with a flexible design suitable for integration into various devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional laser scanners are used to achieve precise 3D measurements, then measurement precision is improved, but device size and cost increase
Solution Approach 1:
The patent merges the laser light source and optical detector array into a single monolithic semiconductor component. This integration allows the system to achieve precise 3D measurements while maintaining a compact device size, as the combined component eliminates the need for separate laser modules and detector assemblies that would increase overall device volume.
Solution Approach 2:
The semiconductor laser component serves multiple functions simultaneously: it generates the primary laser beam for illumination and contains the optical detector array for receiving reflected light. This multi-functionality enables precise measurements without requiring additional dedicated components, thus avoiding size increase.
2Measurement precision
If traditional laser scanners are used to achieve precise 3D measurements, then measurement precision is improved, but manufacturing cost increases
Solution Approach 1:
By combining the laser light source and optical detector array into a single monolithic semiconductor component, the patent reduces the number of discrete parts that need to be manufactured and assembled. This integration simplifies the manufacturing process and reduces component costs, making precise 3D scanning more cost-effective.
Solution Approach 2:
The patent replaces traditional mechanical laser scanning systems with a semiconductor-based integrated system. This substitution eliminates complex mechanical assemblies and reduces manufacturing complexity, thereby lowering production costs while maintaining measurement precision.
3Volume of moving object
If the semiconductor laser component is monolithically integrated for compact design, then device size is reduced, but detection sensitivity to interfering factors may worsen
Solution Approach 1:
The patent introduces a scanning mirror structure as an intermediary element that deflects the primary laser beam across the measurement area. This external scanning mechanism allows the integrated semiconductor component to remain compact while the scanning mirror enables systematic light delivery and collection, reducing susceptibility to background light interference through controlled beam paths.
Solution Approach 2:
The scanning mirror structure implements periodic scanning motion to systematically illuminate and collect light from different positions. This periodic action allows the compact integrated component to achieve comprehensive measurement coverage while the time-separated transmission and detection cycles help distinguish signal from background interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module enables precise three-dimensional shape capture with a compact design, capable of detecting subtle surface features and changes at high scanning velocities, making it suitable for use in devices like smartphones and pico projectors, while being less sensitive to interfering factors like background light and temperature fluctuations.
Implementation Method 1
the semiconductor laser component include a Doppler sensor, the Doppler sensor being, in particular a vertical cavity surface-emitting laser (VCSEL) or a vertical external-cavity surface-emitting laser (VeCSEL)... This makes it advantageously possible to use the Doppler sensor to contactlessly detect a velocity—for example, of a projection point on the surface of the object—and/or a distance
Implementation Method 2
The semiconductor laser component is preferably a laser light source for generating the primary beam radiated into the position finding zone, the primary beam being composed of visible light and/or infrared light, for example
Implementation Method 3
the optical detector array including a photodetector whose signal is preferably used for distance measurement and/or velocity measurement... the secondary signal is, in particular the reflection signal component that is detectable by the module and that returns thereto
Data Source
AI summary
A module for measuring an object located in a position finding zone; the module being configured for generating a primary beam; the module having a scanning mirror structure; the scanning mirror structure being controllable to allow the primary beam to execute a scanning movement within the position finding zone; the module being configured to allow a secondary signal to be detected when the secondary signal is produced in response to the interaction of the primary beam with the object in a deflection position of the scanning mirror structure; the module being configured to generate position finding information as a function of the deflection position of the scanning mirror structure; the module featuring a semiconductor laser component; the semiconductor laser component being configured for producing the primary beam and for detecting the secondary signal.