Monolithic Thermal Management Device with Integral Channels
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Solution Overview
Problem
Existing thermal management devices for heat-generating sources, such as electronic assemblies, face inefficiencies due to high thermal resistance, complex manufacturing processes, and limited design flexibility, which are exacerbated by increasing circuit densities and smaller component sizes.
Innovation Solution
A monolithic, thermally conductive body with integrally formed channels for heat dissipation, fabricated using metallurgical bonding of multiple layers of metal foil, allowing for reduced material and labor costs, improved thermal performance, and adaptability to various geometries and heat exchange technologies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discrete heat pipes and metal sheets are assembled together, then heat transfer capability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges multiple discrete thermal management components (heat pipes, metal sheets, adhesives) into a single monolithic body with integrally formed channels. This eliminates the need for assembly of multiple parts while maintaining heat transfer capability, directly resolving the contradiction between heat transfer performance and device complexity.
Solution Approach 2:
The monolithic body serves multiple functions simultaneously: it provides structural support, conducts heat, and contains integrated fluid channels for active cooling. This multi-functionality eliminates the need for separate components, reducing device complexity while maintaining thermal management effectiveness.
2Reliability
If multiple discrete parts with adhesives are used, then heat transfer capability is improved, but thermal resistance increases
Solution Approach 1:
By combining all thermal management functions into a monolithic structure, the patent eliminates adhesive layers and multiple interfaces that create thermal resistance. The integral construction ensures continuous thermal pathways from heat source to dissipation points, reducing energy loss while maintaining heat transfer capability.
3Reliability
If multiple individual parts are assembled, then heat transfer capability is improved, but manufacturing cost and time increase
Solution Approach 1:
The patent combines multiple manufacturing steps and components into a single monolithic structure that can be fabricated as one piece. This eliminates assembly labor, reduces material waste, and simplifies quality control, thereby reducing manufacturing cost and time while maintaining the heat transfer capabilities achieved through multi-component designs.
4Ease of manufacture
If conventional manufacturing techniques are used, then device fabrication is simplified, but design flexibility is limited
Solution Approach 1:
The patent utilizes advanced manufacturing parameters and processes (such as additive manufacturing or precision casting) that enable complex internal channel geometries to be formed directly in the monolithic body. This allows customization of channel paths, cross-sections, and configurations to match specific thermal management requirements while maintaining ease of manufacture through single-step fabrication.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces thermal resistance, lowers manufacturing costs and time, and enhances heat transfer efficiency, enabling the device to be tailored for a wide range of applications with improved reliability and flexibility.
Implementation Method 1
a monolithic, thermally conductive body having integrally formed, embedded channels for channeling heat away from a thermal source
Implementation Method 2
fabricated using metallurgical bonding of multiple layers of metal foil
Data Source
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AI summary
A thermal management device suitable for use as an electronic chassis includes a monolithic, monocoque body having integrally formed channels for carrying thermal energy away from a heat source, such as electronic components. The device may be fabricated using additive/subtractive manufacturing processes such as ultrasonic consolidation.