Monolithic Transceiver Bridges 12V and 48V Domains
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Solution Overview
Problem
In mixed 12V/48V CAN networks of Mild Electric Hybrid Vehicles, existing solutions require expensive galvanic isolation to mitigate ground offsets and common mode transients, which can lead to communication disturbances and high voltage differences, necessitating a more cost-effective and efficient method for interfacing between different voltage domains.
Innovation Solution
A transceiver device with internal communication links that bridge between voltage domains, eliminating the need for galvanic isolation by using differential voltage transmission or digital current loop transmission, allowing for a monolithic integrated circuit design that tolerates ground offsets and common mode transients.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If galvanic isolation barriers (transformer, capacitor, or optocoupler) are used to mitigate ground offsets and common mode transients, then communication reliability is improved, but device complexity and cost increase due to multi-chip module packages or separate galvanic isolation devices
Solution Approach 1:
The patent combines the CAN transceiver functionality with galvanic isolation capabilities into a single integrated circuit die. The isolation mechanism is integrated directly into the transceiver chip, eliminating the need for separate galvanic isolation devices or multi-chip module packages. This merging approach maintains communication reliability while significantly reducing device complexity and cost.
Solution Approach 2:
The patent introduces an isolated communication link as an intermediary mechanism between the 48V domain and the 12V/24V domain. This isolated link acts as a mediator that transfers data signals while blocking ground offsets and common mode transients, providing galvanic isolation without requiring traditional isolation barriers.
2Reliability
If galvanic isolation barriers are used to handle ground offsets and common mode transients, then communication disturbances are reduced, but cost increases due to expensive multi-chip module packages or separate isolation devices
Solution Approach 1:
The patent merges galvanic isolation functionality with the CAN transceiver into a single integrated circuit, eliminating the need for expensive multi-chip module packages or separate isolation devices. This integration dramatically reduces manufacturing cost while maintaining communication stability in mixed voltage domain environments.
3Reliability
If traditional galvanic isolation methods are used, then protection against high voltage differences is achieved, but the solution requires multiple integrated circuit dies or separate devices
Solution Approach 1:
The patent combines transceiver functionality with galvanic isolation capabilities into a single integrated circuit die, eliminating the need for multiple dies or separate devices. The isolated communication link is implemented directly within the transceiver chip, providing voltage domain isolation while reducing the component count to one unified device.
Data Source
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AI summary
Disclosed are a transceiver device (100) and a method for interfacing between at least two different voltage domains (12, 14), namely a first supply voltage domain (12) having a higher first supply voltage and a second supply voltage domain (14) having a lower second supply voltage. The transceiver device (100) has: a first interface (110), which is supplied by the first supply voltage and is adapted to interface to at least one external first digital device (20) operating in the first supply voltage domain (12); a second interface (120), which is supplied by the second supply voltage and is adapted to interface to an external communication bus (24) operating in the second supply voltage domain (14); a first internal communication link (130), which is adapted to transfer transmit data, which can be generated by the external first digital device (20) operating in the first supply voltage domain (12), from the first interface (110) to the second interface (120), and a second internal communication link (170), which is adapted to transfer transmit data, which can be supplied from the external communication bus (24) operating in the second supply voltage domain (14), from the second interface (120) to the first interface (110). The transceiver device (100) may be embodied as a monolithic integrated circuit, which may be implemented in silicon-on-insulator, SOI, technology. The first and the second internal communication link (130, 170) may be based on the principles of one of differential voltage transmission (140, 180) and digital current loop transmission (150, 190).