Monolithic Translucent Cover for Semiconductor Optical Devices

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional semiconductor packages are inadequate, leading to excess cost, decreased reliability, and large package sizes, which hinder performance.

Innovation Solution

A semiconductor device design featuring a substrate with optical devices and a translucent cover comprising a unitary monolithic piece of a cover base and cover pipe, supported by a cover structure, which reduces manufacturing steps and enhances protection and electrical coupling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional semiconductor packages are used, then manufacturing processes are established, but cost is excessive and reliability is decreased

Engineering Contradiction:

Improvepackage reliabilityVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent merges the cover base and cover pipe into a single unitary monolithic piece, eliminating the need for separate manufacturing and assembly processes. This integration reduces the number of manufacturing steps, lowers costs, and improves reliability by eliminating potential failure points at joints between separate components.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The unitary cover structure serves multiple functions simultaneously: it provides environmental protection, structural support, and optical transmission. The monolithic design accomplishes what previously required multiple specialized components, simplifying manufacturing while maintaining or improving reliability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Volume of moving object

If conventional semiconductor packages are used, then packaging is provided, but package size is too large

Engineering Contradiction:

Improvepackage sizeVSAvoidpackage performance

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

By combining the cover base and cover pipe into one integrated component, the patent eliminates the space and material required for separate parts and their assembly interfaces. This merging reduces the overall package volume while maintaining the protective and functional performance requirements.

Inventive Principle:

Principle #5Merging (Combining)

3Ease of manufacture

If multiple separate cover components are used, then assembly is provided, but manufacturing steps are excessive and cost increases

Engineering Contradiction:

Improvemanufacturing stepsVSAvoidcover structure complexity

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent integrates multiple cover components into a single unitary monolithic piece, dramatically reducing the number of manufacturing steps and assembly operations. This consolidation simplifies the manufacturing process, lowers costs, and reduces device complexity while maintaining all necessary functions.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS11257976B2Semiconductor devices and methods of manufacturing semiconductor devices

Publication Date: 2022.02.22 AMKOR TECH SINGAPORE HLDG PTE LTD

AI summary

In one example, a semiconductor device comprises a substrate, an optical device on a top side of the substrate, a translucent cover over the optical device, wherein the translucent cover is a unitary monolithic piece comprising a cover base and a cover pipe. and a cover structure on the top side of the substrate to support the translucent cover over the optical device. Some examples and related methods are also disclosed herein.