Monolithic Optoelectronic Assembly for VCSEL Detector Synchronization
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Solution Overview
Problem
Existing optical devices using optical electronic assemblies require separate mounting systems for individual optical electronic elements, leading to large spacings and inefficiencies due to larger tolerances in PCB and trace manufacturing, resulting in degraded system-level performance and increased power consumption.
Innovation Solution
An optical transceiver device with a monolithic design where a vertical-cavity surface-emitting laser (VCSEL) and optical detector are mounted on a single integrated circuit (IC) substrate, utilizing conductive pillars and interconnection layers to confine electrical communication paths within the IC, reducing spacing and reliance on a printed circuit board (PCB) for synchronization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If separate mounting substrates (PCB) are used for individual optical electronic elements, then ease of manufacture is improved, but spacing between elements increases and manufacturing precision deteriorates
Solution Approach 1:
The patent merges multiple separate mounting substrates into a single integrated substrate that accommodates all optical electronic elements (VCSELs, optical detectors, and associated electronics). This integration eliminates the need for separate PCB mounting for each element, thereby reducing spacing between components while maintaining ease of manufacture through a unified fabrication process.
2Ease of manufacture
If separate mounting substrates are used for individual optical electronic elements, then ease of manufacture is improved, but device size increases
Solution Approach 1:
The patent combines multiple optical electronic elements that were previously mounted on separate substrates into a single integrated substrate. This merging eliminates the need for multiple separate mounting plates and reduces the overall device volume by consolidating the optical path and electronic components into a compact arrangement.
3Ease of manufacture
If larger tolerances in PCB and trace manufacturing are used, then ease of manufacture is improved, but synchronization performance deteriorates
Solution Approach 1:
The patent integrates the optical detectors and VCSELs onto the same substrate with directly connected traces, eliminating the need for long inter-substrate connections through PCBs. This integration ensures that timing-critical signals traverse short, controlled paths with precise length matching, achieving sub-100fs synchronization performance while maintaining ease of manufacture through standard integrated circuit fabrication processes.
Data Source
AI summary
An optoelectronic assembly includes a printed circuit board (PCB), an integrated circuit (IC) substrate operably mounted on the PCB, the IC substrate comprising at least one of active elements and passive elements, a vertical-cavity surface-emitting laser (VCSEL) operably mounted on a first surface of the IC substrate, an optical detector operably mounted adjacent to the VCSEL on the first surface of the IC substrate, and a molding compound formed on the IC substrate encapsulating a plurality of sides of the VCSEL and a plurality of sides of the optical detector, in which at least one electrical communication path between the optical detector and the VCSEL is confined within the IC substrate.