MOS Transistor Cell Disabling for SOA and Low On-Resistance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
MOS transistors with cellular structures face limitations in their Safe Operating Area (SOA) due to increased drain/source on-state resistance when dummy regions are used to dissipate heat, which affects their performance, especially in the linear region.
Innovation Solution
Incorporating disabling structures in selected cells that can be non-conductive during high gate/source voltage conditions to reduce heating and inactive during saturation, allowing for dynamic cell disabling based on operating conditions, thereby maintaining low on-state resistance in linear regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If source regions are removed in some cells to act as dummy regions for heat dissipation, then thermal limitation is improved, but drain/source on-state resistance increases
Solution Approach 1:
The patent applies dynamics by making the disabling structure's conductivity state changeable based on operating conditions. The disabling structure transitions between conductive and non-conductive states depending on the voltage applied to the gate, allowing the MOS transistor to dynamically adjust which cells are active. This resolves the contradiction by enabling heat dissipation through disabled cells during high-power operation while maintaining low on-state resistance through full cell activation during normal operation.
2Object-affected harmful factors
If cells are disabled to reduce heating, then thermal runaway is prevented, but the number of active source regions decreases increasing resistance
Solution Approach 1:
The patent applies self-service by enabling the MOS transistor to automatically regulate its own thermal state through the disabling structure. When thermal conditions indicate potential runaway, the disabling structure naturally transitions to a conductive state that disables certain cells, allowing those regions to serve as heat sinks. This self-regulating mechanism prevents thermal runaway while minimizing resistance increase by only disabling cells when genuinely needed for thermal management.
3Temperature
If dummy regions are created to increase heat sink capacity, then thermal limitation is improved, but device area is reduced for current conduction
Solution Approach 1:
The patent applies multi-functionality by enabling cell regions to serve dual purposes: they can function as active current-conducting regions when needed for low resistance, or as dummy heat-sink regions when thermal management is prioritized. The disabling structure allows the same physical space to be dynamically allocated between these two functions based on operating conditions, maximizing both heat sink capacity and current conduction area without permanent sacrifice of either.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively limits heating and maintains low drain/source on-state resistance, enhancing the MOS transistor's performance by dynamically controlling cell activity based on operating conditions, thus expanding its Safe Operating Area without adverse effects on resistance.
Implementation Method 1
a disabling structure (150, 175) provided in each of one or more selected cells; the disabling structure being configured to be in a non-conductive condition when the MOS transistor is switched on in response to a control voltage comprised between a threshold voltage of the MOS transistor and an intervention voltage of the disabling structure, or to be in a conductive condition otherwise
Data Source
Figure 1
Figure 2
Figure 3A~3B
AI summary
An integrated device (100) is proposed comprising at least one MOS transistor (105) having a plurality of cells (135,150). In each of one or more of the cells (135,150) a disabling structure (175,180) is provided; the disabling structure (175,180) is configured to be in a non-conductive condition when the MOS transistor (105) is switched on in response to a control voltage comprised between a threshold voltage of the MOS transistor (105) and an intervention voltage of the disabling structure (175,180), or to be in a conductive condition otherwise. A system (400) comprising at least one integrated device (100) as above is also proposed. Moreover, a corresponding process for manufacturing this integrated device (100) is proposed.