Trench-Gate MOSFET With Dual Threshold Regions

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Solution Overview

Problem

The miniaturization of power MOSFETs leads to increased channel density, which reduces on-resistance but narrows the safe operating area due to thermal runaway, necessitating a balance between reducing on-resistance and widening the safe operating area.

Innovation Solution

A semiconductor device with a trench-gate MOSFET structure featuring regions of different threshold voltages, where a low threshold voltage region is activated at low gate voltage to restrict transconductance and a high threshold voltage region is activated at high gate voltage to reduce on-resistance, thereby managing thermal runaway and expanding the safe operating area.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If channel density is increased to reduce on-resistance, then on-resistance is reduced, but thermal runaway occurs which narrows the safe operating area

Engineering Contradiction:
Improvesafe operating areaVSAvoidthermal runaway
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent applies local quality by creating regions with different threshold voltages within the MOSFET structure. Specifically, it forms a first region with a first threshold voltage and a second region with a second threshold voltage that is higher than the first threshold voltage. This spatial differentiation allows different parts of the device to exhibit different electrical characteristics, enabling the low threshold voltage region to conduct at lower gate voltages while the high threshold voltage region activates at higher gate voltages to reduce on-resistance without causing thermal runaway.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent utilizes parameter changes by varying the threshold voltage parameter across different regions of the MOSFET. The first region is designed with a lower threshold voltage to enable conduction at lower gate voltages, while the second region is designed with a higher threshold voltage to activate at higher gate voltages. This parameter differentiation allows the device to operate in different modes depending on the applied gate voltage, effectively managing thermal runaway while maintaining low on-resistance.

Inventive Principle:
Principle #35Parameter changes

2Ease of operation

If low threshold voltage region is activated to enable conduction at low gate voltage, then ease of operation is improved, but transconductance increases which may cause thermal runaway

Engineering Contradiction:
Improveconduction at low gate voltageVSAvoidthermal runaway
Core Design Contradiction:
Ease of operationVSObject-generated harmful factors

Solution Approach 1:

The patent applies local quality by creating regions with different threshold voltages within the MOSFET structure. Specifically, it forms a first region with a first threshold voltage and a second region with a second threshold voltage that is higher than the first threshold voltage. This spatial differentiation allows different parts of the device to exhibit different electrical characteristics, enabling the low threshold voltage region to conduct at lower gate voltages while the high threshold voltage region activates at higher gate voltages to reduce on-resistance without causing thermal runaway.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent applies preliminary anti-action by designing the device structure to preemptively counteract thermal runaway. The presence of the second region with the higher threshold voltage acts as a built-in protective mechanism. When the gate voltage increases and activates the second region, it provides an additional conduction path that helps distribute current and prevent localized overheating, thereby counteracting the potential thermal runaway that could arise from the high transconductance of the first region.

Inventive Principle:
Principle #9Preliminary anti-action

Data Source

PatentUS10651276B2Semiconductor device
Publication Date: 2020.05.12 KK TOSHIBA
  • US10651276B2 patent drawing
  • US10651276B2 patent drawing
  • US10651276B2 patent drawing

AI summary

A semiconductor device has a cell which includes a first semiconductor region of a first conductive type, a base region of a second conductive type on the first semiconductor region, a source region of the first conductive type on the base region, a gate electrode penetrating through the base region in a first direction to reach the first semiconductor region and extending in a second direction, and a gate insulting film between the gate electrode and the first semiconductor region, between the gate electrode and the base region, and between the gate electrode and the source region. The cell has a region having a first threshold voltage and a region having a second threshold voltage higher than the first threshold voltage.