Integrated MOSFET-JFET Die for Low Forward Voltage Reverse Blocking
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Solution Overview
Problem
Conventional battery charging circuits with Schottky diodes have issues with package size and cost due to the need for a separate diode and MOSFET package, and they lack effective reverse blocking during accidental short circuits.
Innovation Solution
Integration of a diode-connected enhancement mode junction field effect transistor (JFET) with a MOSFET on a single semiconductor die, which functions as a reverse blocking diode with a low forward voltage drop and low reverse leakage current, replacing the conventional Schottky diode.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a Schottky diode and MOSFET are packaged separately in a co-package, then reverse blocking function is provided, but package size and manufacturing cost increase
Solution Approach 1:
The patent integrates the Schottky diode and MOSFET onto a single semiconductor die by forming the diode using the MOSFET's drain region and substrate, eliminating the need for a separate diode die and reducing package size while maintaining reverse blocking functionality
Solution Approach 2:
The MOSFET structure is designed to serve dual functions: the main MOSFET for power switching and the integrated diode structure (using drain-substrate junction) for reverse blocking, allowing one device to perform multiple functions that previously required separate components
2Reliability
If a Schottky diode and MOSFET are packaged separately in a co-package, then reverse blocking function is provided, but manufacturing cost increases
Solution Approach 1:
The patent integrates the Schottky diode and MOSFET onto a single semiconductor die by forming the diode using the MOSFET's drain region and substrate, eliminating the need for a separate diode die and reducing package size while maintaining reverse blocking functionality
Solution Approach 2:
The MOSFET structure is designed to serve dual functions: the main MOSFET for power switching and the integrated diode structure (using drain-substrate junction) for reverse blocking, allowing one device to perform multiple functions that previously required separate components
3Device complexity
If a MOSFET with built-in body diode is used, then device simplicity is maintained, but reverse blocking during short circuit fails
Solution Approach 1:
The patent modifies the local structure by creating a specially doped drain region with specific conductivity type opposite to the substrate, forming a diode structure with appropriate forward voltage drop characteristics that enables reverse blocking while maintaining the overall MOSFET structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration reduces package size and manufacturing costs while providing effective reverse blocking and low forward voltage drop, comparable to a PN junction diode, and low reverse leakage current, enhancing the safety and efficiency of battery charging circuits.
Implementation Method 1
a diode-connected enhancement mode junction field effect transistor (JFET) with its source, body and gate connected together and biased at a positive voltage with respect to its drain... functions like a diode but has a lower turn-on voltage than a conventional PN diode
Implementation Method 2
The JFET channel element zones act primarily as resistive current paths shunting the equivalent P-N junction diode elements. The conductivity of the JFET channel element zones depends upon the coverage of their neighboring depletion zones
Implementation Method 3
A battery charging source having a first charging terminal and a second charging terminal with the first charging terminal connected to the first battery terminal. A serial connection of a MOSFET and an enhancement mode JFET for bridging the second charging terminal to the second battery terminal
Data Source
AI summary
A semiconductor die with integrated MOSFET and diode-connected enhancement mode JFET is disclosed. The MOSFET-JFET die includes common semiconductor substrate region (CSSR) of type-1 conductivity. A MOSFET device and a diode-connected enhancement mode JFET (DCE-JFET) device are located upon CSSR. The DCE-JFET device has the CSSR as its DCE-JFET drain. At least two DCE-JFET gate regions of type-2 conductivity located upon the DCE-JFET drain and laterally separated from each other with a DCE-JFET gate spacing. At least a DCE-JFET source of type-1 conductivity located upon the CSSR and between the DCE-JFET gates. A top DCE-JFET electrode, located atop and in contact with the DCE-JFET gate regions and DCE-JFET source regions. When properly configured, the DCE-JFET simultaneously exhibits a forward voltage Vf substantially lower than that of a PN junction diode while the reverse leakage current can be made comparable to that of a PN junction diode.


