MOSFET Module Layout With Relay Integration for Compact Inverter PCBs
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Solution Overview
Problem
Conventional electric driving devices occupy a large area on a substrate due to individually packaged high potential MOSFETs, low potential MOSFETs, and phase relay MOSFETs, which complicates the drive circuit unit and increases the overall size.
Innovation Solution
The electronic device integrates upper and lower arm modules, relay modules, and peripheral components on a substrate, arranging them in a specific order to reduce the occupied area, with peripheral components positioned between arm modules and output terminals, and using high thermal conductivity resin for sealing to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If upper arm elements, lower arm elements, and relay elements are individually packaged, then each component can be independently manufactured and replaced, but the occupied area on the substrate becomes large and the device complexity increases
Solution Approach 1:
The patent combines multiple individually packaged components (upper arm elements, lower arm elements, and relay elements) into an integrated module structure. This merging reduces the total occupied area on the substrate while maintaining the functional independence of each component through modular design, allowing them to be manufactured and replaced as a unified unit.
Solution Approach 2:
The patent implements a nested arrangement where relay elements are positioned adjacent to and integrated with upper and lower arm element modules. This nesting strategy allows components to share substrate space efficiently, with the relay module occupying the same regional area as the arm element modules, thereby reducing the overall device footprint.
2Ease of manufacture
If components are arranged in a conventional layout, then manufacturing and assembly are straightforward, but the area occupied by the inverter circuit and peripheral components becomes large
Solution Approach 1:
The patent transitions from a conventional linear or grid-based component layout to a spatial arrangement where upper and lower arm element modules are positioned adjacent to each other, with relay modules integrated between them. This dimensional reorganization optimizes space utilization by arranging components in a compact two-dimensional configuration rather than extending them across a larger substrate area.
3Area of stationary object
If components are closely integrated to reduce area, then the device size is optimized, but heat dissipation becomes more challenging
Solution Approach 1:
The patent applies local quality optimization by strategically positioning upper and lower arm element modules adjacent to each other with relay modules integrated between them. This localized arrangement creates efficient thermal pathways while maintaining compact dimensions, allowing heat to be dissipated through concentrated thermal management zones rather than requiring extensive surface area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the area occupied by the inverter circuit and peripheral components on the substrate, facilitating efficient heat dissipation and simplifying the processing of the heat sink, thereby optimizing the device's size and functionality.
Implementation Method 1
using high thermal conductivity resin for sealing to enhance heat dissipation
Data Source
AI summary
An electronic device includes an upper and lower arm module including an upper arm element and a lower arm element as one module, a relay module including one relay element that switches connection and disconnection between the upper and lower arm module and an output terminal, and a peripheral component including at least one of a current detection element and a noise removal element. The upper and lower arm module, the relay module and the output terminal are arranged in this order along a direction from a centerline of the substrate toward an outer end of the substrate on a same surface of a substrate. The peripheral component is arranged side by side with the relay module in a region between the upper and lower arm module and the output terminal.