Shield Electrode Structure for MOSFET On-Resistance
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Solution Overview
Problem
Existing MOSFET devices with recessed field plate designs face challenges such as higher gate-to-drain capacitance, excessive ringing, lower breakdown voltages, and inferior figures of merit like unclamped inductive switching, which hinder the reduction of specific on-resistance and improve switching characteristics.
Innovation Solution
The implementation of a shield electrode structure with a wide portion proximal to the channel junction and a narrow portion deeper in the drift region, separated by distinct dielectric layers, along with increased dopant concentration in the drain region near the wide portion, to reduce on-resistance and enhance switching performance while maintaining breakdown voltage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If recessed field plate design is used to reduce on-resistance, then specific on-resistance decreases, but gate-to-drain capacitance increases
Solution Approach 1:
The shield electrode is divided into two distinct portions: a first portion (wider) separated from the semiconductor layer by a first dielectric layer, and a second portion (narrower) separated by a second dielectric layer. This segmentation allows each portion to serve different functions in managing electric field distribution, reducing on-resistance while controlling capacitance.
Solution Approach 2:
Different portions of the shield electrode structure have different properties: the first portion has a wider width and is separated by a first dielectric layer, while the second portion has a narrower width and is separated by a second dielectric layer. This local differentiation optimizes the balance between on-resistance reduction and capacitance control in different spatial regions.
2Quantity of substance
If recessed field plate design is used to reduce on-resistance, then specific on-resistance decreases, but ringing increases
Solution Approach 1:
The shield electrode is divided into two distinct portions: a first portion (wider) separated from the semiconductor layer by a first dielectric layer, and a second portion (narrower) separated by a second dielectric layer. This segmentation allows each portion to serve different functions in managing electric field distribution, reducing on-resistance while controlling capacitance.
Solution Approach 2:
Different portions of the shield electrode structure have different properties: the first portion has a wider width and is separated by a first dielectric layer, while the second portion has a narrower width and is separated by a second dielectric layer. This local differentiation optimizes the balance between on-resistance reduction and capacitance control in different spatial regions.
3Quantity of substance
If recessed field plate design is used to reduce on-resistance, then specific on-resistance decreases, but breakdown voltage decreases
Solution Approach 1:
The shield electrode is divided into two distinct portions: a first portion (wider) separated from the semiconductor layer by a first dielectric layer, and a second portion (narrower) separated by a second dielectric layer. This segmentation allows each portion to serve different functions in managing electric field distribution, reducing on-resistance while controlling capacitance.
Solution Approach 2:
Different portions of the shield electrode structure have different properties: the first portion has a wider width and is separated by a first dielectric layer, while the second portion has a narrower width and is separated by a second dielectric layer. This local differentiation optimizes the balance between on-resistance reduction and capacitance control in different spatial regions.
Data Source
AI summary
In one embodiment, a semiconductor device includes a multi-portion shield electrode structure formed in a drift region. The shield electrode includes a wide portion formed in proximity to a channel side of the drift region, and a narrow portion formed deeper in the drift region. The narrow portion is separated from the drift region by a thicker dielectric region, and the wide portion is separated from the drift region by a thinner dielectric region. That portion of the drift region in proximity to the wide portion can have a higher dopant concentration than other portions of the drift region.


