Mother Substrate Wiring for Flat Panel Display Sealing

The patent replaces conventional mechanical sealing methods with a thermal processing system. Wiring units with connecting units form a heating system that generates heat to melt and harden sealing members (frit), creating hermetic seals. This substitution of mechanical sealing with thermal processing resolves the contradiction by achieving superior sealing reliability through a controlled thermal field rather than simple mechanical assembly.

The patent utilizes controlled changes in temperature parameters through the wiring units to transform the sealing member material from solid to molten state and back to hardened state. By controlling the thermal parameters (heating rate, temperature distribution, cooling rate), the system achieves reliable sealing while managing the complexity of the manufacturing process through precise parameter control rather than complex mechanical structures.

The patent replaces conventional external heating methods with an integrated thermal system where wiring units serve dual purposes: electrical connectivity and heating. The connecting units between wiring units create a distributed heating network that provides uniform heat distribution across the sealing member, ensuring even melting and hardening. This resolves the contradiction by achieving manufacturing precision through uniform thermal fields while maintaining efficient processing time.

The patent incorporates heating capability into the wiring unit structure itself, performing the sealing function as an integrated step rather than a separate process. The wiring units are pre-configured with connecting units that enable them to generate heat when voltage is applied, allowing the sealing member to be melted and hardened in-situ during the manufacturing process. This preliminary integration of heating function reduces overall process time while ensuring uniform thermal treatment.