Image Device Motherboard Alignment Marks With Nonintersecting Grooves
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Solution Overview
Problem
The formation of marks with quadrangular or cross-like recessed portions in image devices leads to difficulties in filling these areas with a filling film due to large opening widths, which can result in cracks and hinder mark recognition, especially when the grooves intersect, causing stress and incomplete filling.
Innovation Solution
The recessed portions in the substrate or motherboard include first and second grooves extending in different directions without intersecting, ensuring narrow widths and allowing for effective filling of the film, reducing the likelihood of cracks and improving mark visibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the recessed portion is formed to have a quadrangular shape, then the opening width is large, but it becomes difficult to fill the recessed portion with the filling film in an appropriate manner
Solution Approach 1:
The recessed portion is segmented into multiple narrow grooves (first groove and second groove) instead of a single large quadrangular space. This segmentation allows the filling film to be deposited along the narrow groove walls where capillary action and surface tension facilitate complete filling, rather than attempting to fill a large open area where the film would bridge across and leave gaps.
Solution Approach 2:
The design transitions from a two-dimensional planar opening (quadrangular shape) to a three-dimensional structured configuration with intersecting grooves at different levels and orientations. The grooves extend in first and second directions that intersect but do not intersect each other in plan view, creating a network structure that provides multiple filling pathways and ensures complete coverage.
2Shape
If the recessed portion is formed to have a cross-like shape, then the opening width in oblique direction is large at crossing portion, but it becomes difficult to fill the recessed portion with the filling film in an appropriate manner
Solution Approach 1:
The cross-like recessed portion is segmented into multiple narrow grooves (first groove and second groove) instead of a single large open space. This segmentation ensures that even at the crossing portion, the filling film can properly adhere to the groove walls and fill the space completely, rather than bridging across a wide opening.
Solution Approach 2:
The groove configuration provides different local qualities at different positions: narrow widths throughout the groove paths to facilitate film filling, while the overall pattern maintains the cross-like shape for mark recognition. The grooves are designed with appropriate spacing and orientation to ensure uniform filling quality at all locations including the crossing portion.
3Shape
If the grooves intersect, then the mark structure is formed, but stress may generate cracks in the recessed portion that make it difficult to recognize the mark
Solution Approach 1:
The intersecting groove structure is segmented into separate first and second grooves that extend in different directions. By controlling the groove widths and spacing, the design maintains structural integrity and reduces stress concentration that would otherwise lead to cracks, while still forming the necessary mark pattern for alignment purposes.
4Device complexity
If the recessed portion has large opening width, then the mark structure is simple, but there is a difficulty in filling the recessed portion with the filling film
Solution Approach 1:
The simple mark structure is achieved by segmenting the recessed portion into a network of narrow grooves rather than complex three-dimensional features. This segmentation maintains relative structural simplicity while dramatically improving fillability, as the narrow groove configuration allows complete filling without requiring complex filling processes or equipment.
Data Source
AI summary
At a motherboard for an image device, which is used for manufacturing an image device such as a liquid crystal device, an organic electroluminescence device, a mirror device, and an image-capturing device, a mark for alignment is provided on an outer side of a pixel area in which a plurality of pixels are arranged. In the photo-lithography process, a light exposure mask is arranged by using the mark as a reference position. For the mark, a recessed portion provided in a motherboard main body is filled with a filling film. The recessed portion includes a first groove extending along a first direction and a second groove extending along a second direction intersecting with the first direction, the second groove not intersecting with the first groove in plan view.