Motherboard Peripheral Temperature Control During Extreme Overclocking

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Solution Overview

Problem

During extreme overclocking of CPU, GPU, or memory modules, the peripheral circuit elements on a motherboard are either not cooled optimally or excessively cooled, leading to inefficient operation of the overclocking target elements due to suboptimal or extreme temperatures.

Innovation Solution

A temperature adjustment module comprising a temperature control module, a temperature changing module, and a temperature sensor that detects the peripheral temperature and adjusts it to a target temperature using heat conduction materials and temperature-variable components to ensure optimal working conditions for both main and peripheral circuit elements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If liquid nitrogen or liquid helium is used to cool down the overclocking target element, then the frequency of the overclocking target element may be increased to an extremely high frequency, but the peripheral circuit element may be excessively cooled down, resulting in insufficient operating efficiency

Engineering Contradiction:

Improvefrequency of overclocking target elementVSAvoidtemperature of peripheral circuit element

Core Design Contradiction:

SpeedVSTemperature

Solution Approach 1:

The cooling system is divided into two independent parts: a first cooling module for the main circuit element and a second cooling module for the peripheral circuit element. This segmentation allows each module to independently control the temperature of its respective target, enabling the main element to be cooled to extremely low temperatures for overclocking while the peripheral element is maintained at a moderate temperature for optimal operation.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different cooling intensities are applied to different locations on the motherboard. The first cooling module applies intense cooling (liquid nitrogen or helium) locally to the overclocking target, while the second cooling module applies gentle cooling to the peripheral circuit elements. This local differentiation ensures that each region receives the appropriate temperature treatment for its specific functional requirements.

Inventive Principle:

Principle #3Local quality

2Reliability

If the peripheral circuit element is not cooled optimally, then the operating efficiency of the overclocking target element cannot work normally, but using a separate cooling module increases device complexity

Engineering Contradiction:

Improveoperating efficiency of overclocking target elementVSAvoidcooling system structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The temperature control module serves multiple functions: it controls both the first cooling module and the second cooling module, manages temperature sensing for both main and peripheral elements, and adjusts cooling intensity dynamically. This multi-functionality consolidates control logic into a single unit, reducing overall system complexity despite the presence of multiple cooling modules.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

Temperature sensors continuously monitor the temperature of both the main circuit element and the peripheral circuit element, providing real-time feedback to the temperature control module. Based on this feedback, the control module dynamically adjusts the cooling intensity of both modules, ensuring optimal temperatures are maintained without requiring complex manual intervention or oversimplified fixed-temperature systems.

Inventive Principle:

Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The module effectively maintains peripheral circuit elements at optimal temperatures, ensuring the main circuit elements operate efficiently during overclocking by preventing overheating or undercooling, thus enhancing overall system performance.

Implementation Method 1

The temperature sensor is in contact with the peripheral circuit element

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The temperature changing module is in contact with a peripheral circuit element

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 3

When a cool down module on a main circuit element of the mother board cools down the main circuit element

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20240414834A1Temperature adjustment module and temperature adjustment method

Publication Date: 2024.12.12 GIGA BYTE TECH CO LTD

AI summary

A temperature adjustment module and a temperature adjustment method are provided. The temperature adjustment module includes a temperature control module, a temperature changing module, and a temperature sensor. The temperature changing module is in contact with a peripheral circuit element and electrically connected to the temperature control module. The temperature sensor is in contact with the peripheral circuit element and electrically connected to the temperature control module. When a cool down module on a main circuit element of a mother board cools down the main circuit element, the temperature sensor detects a peripheral temperature of the peripheral circuit element. The temperature control module determines whether the peripheral temperature is lower than or higher than a target temperature to determine whether to operate the temperature changing module to perform temperature adjustment on the peripheral circuit element.