Motherboard Temperature Module for Extreme Overclocking Stability

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Solution Overview

Problem

During extreme overclocking of CPU, GPU, or memory modules, the peripheral circuit elements on a motherboard are either not cooled sufficiently or cooled to excessively low temperatures, leading to inefficient operation of the overclocking target elements due to suboptimal working temperatures.

Innovation Solution

A temperature adjustment module comprising a temperature changing module and a temperature control module, where the temperature changing module is in contact with peripheral circuit elements through a heat conduction material and includes a printed circuit board with winding wires or temperature-variable electronic components, allowing for precise temperature adjustment by the temperature control module to reach target temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If liquid nitrogen or liquid helium is used to cool down the overclocking target element, then the frequency of the overclocking target element may be increased to an extremely high frequency, but the peripheral circuit element on the mother board may be simultaneously cooled down to excessively low temperatures, resulting in insufficient or excessive cooling that prevents normal operation

Engineering Contradiction:

Improvefrequency of overclocking target elementVSAvoidtemperature of peripheral circuit element

Core Design Contradiction:

SpeedVSTemperature

Solution Approach 1:

The cooling system is divided into two independent parts: a first cooling module for the main circuit element and a second cooling module for the peripheral circuit element. This segmentation allows each module to independently control the temperature of its respective target, enabling the main circuit element to be cooled to extremely low temperatures for overclocking while the peripheral circuit element is cooled to a moderate, optimal operating temperature range.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different cooling intensities are applied to different locations on the mother board. The first cooling module applies intense cooling (liquid nitrogen or helium) specifically to the main circuit element area, while the second cooling module applies gentler cooling to the peripheral circuit element area. This local differentiation ensures that each region receives the appropriate temperature control for its specific functional requirements.

Inventive Principle:

Principle #3Local quality

2Productivity

If the peripheral circuit element is cooled to extremely low temperatures, then the main circuit element can achieve extreme overclocking, but the operating efficiency of the peripheral circuit element cannot work normally due to suboptimal working temperature

Engineering Contradiction:

Improveoverclocking efficiency of main circuit elementVSAvoidoperating efficiency of peripheral circuit element

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The system changes the temperature parameters differently for different circuit elements. The first cooling module targets a very low temperature range (extreme cooling) for the main circuit element to enable overclocking, while the second cooling module targets a moderate temperature range (optimal operating temperature) for the peripheral circuit element. This parameter differentiation ensures both high productivity for overclocking and high reliability for peripheral operation.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the peripheral circuit elements to operate at optimal temperatures, ensuring the main circuit elements can achieve efficient overclocking performance by synchronizing temperature adjustments with the cooling process of the main circuit elements.

Implementation Method 1

The temperature changing module is in contact with a peripheral circuit element on a mother board through the temperature changing area and a heat conduction material

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

The temperature of the temperature changing module is changed by at least one of a winding wire or an electronic component on the printed circuit board

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS20240414887A1Temperature adjustment module

Publication Date: 2024.12.12 GIGA BYTE TECH CO LTD

AI summary

A temperature adjustment module is provided. The temperature adjustment module includes a temperature changing module and a temperature control module. The temperature changing module includes a temperature changing area. The temperature changing module is in contact with a peripheral circuit element on a motherboard through the temperature changing area and a heat conduction material. The temperature control module is electrically connected to the temperature changing module and configured to control a temperature of the temperature changing module to reach a target temperature. The temperature changing module further includes a printed circuit board in the temperature changing area, and the temperature of the temperature changing module is changed by at least one of a winding wire or an electronic component on the printed circuit board.