Motor Amplifier Heat Dissipation Frame Design
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Solution Overview
Problem
Existing motors suffer from inadequate heat dissipation performance, particularly in the sensor circuit substrate, leading to heat accumulation issues.
Innovation Solution
A motor design featuring a heat dissipation frame arranged perpendicular to the rotation axis direction, which houses substrates and utilizes high conductivity materials like metal for efficient heat transfer, combined with a heat sink unit for enhanced cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If substrates are housed in a compact amplifier within the motor, then the motor integration is improved, but heat dissipation performance deteriorates due to heat accumulation in the sensor circuit substrate
Solution Approach 1:
The patent introduces a heat dissipation frame extending in the radial direction (perpendicular to the rotation axis) to provide an additional heat dissipation dimension. This frame includes heat dissipation fins that extend radially outward, creating a new thermal pathway that does not interfere with the compact motor integration while significantly enhancing heat dissipation capacity from the substrates.
Solution Approach 2:
The heat dissipation frame acts as an intermediary thermal management component between the heat-generating substrates (particularly the sensor circuit substrate) and the external environment. The frame provides a dedicated heat transfer pathway that mediates the thermal interaction, allowing efficient heat dissipation without requiring redesign of the integrated amplifier structure.
2Productivity
If the amplifier housing is made compact to improve motor size, then productivity is improved, but heat dissipation performance worsens due to insufficient heat dissipation area
Solution Approach 1:
The heat dissipation frame extends radially outward from the amplifier housing, utilizing the radial dimension to increase heat dissipation surface area without increasing the axial or radial footprint of the motor. This allows the motor to maintain its compact size while providing sufficient heat dissipation area through the extended fins.
Solution Approach 2:
The heat dissipation frame concentrates thermal management resources (heat dissipation fins and surface area) specifically at the locations where heat is generated by the substrates. The frame is positioned to maximize heat transfer from the sensor circuit substrate and other heat-generating components, providing localized thermal management where it is most needed while maintaining overall motor compactness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves the heat dissipation performance of the amplifier, allowing for effective heat transfer and dissipation from multiple directions, thereby enhancing the motor's thermal management.
Implementation Method 1
the means for dissipating being arranged on a face located in a direction perpendicular to a rotation axis direction of the rotor at the frame
Implementation Method 2
means for dissipating heat of at least one substrate housed in the frame
Data Source
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AI summary
[Probleme to be Solved] The heat dissipation performance of an amplifier of a motor is capable of enhancing. [Solution] A motor 1 comprises a motor part 2 including a stator and a rotor and an amplifier 10 configured to supply electric power to the motor part 2, the amplifier 10 comprises a main body frame 6 constituting a housing of the amplifier 10 and a heat dissipation frame 7 which is arranged on a bottom face 6f located in a direction perpendicular to a rotation axis direction at the main body frame 6 and to which a power source substrate 5c, a DC input substrate 5d, a control substrate 5e, and a control wiring substrate 5f housed in the main body frame 6 are attached.