Motor Control Board Heat Dissipation Through Plastic Housing

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Solution Overview

Problem

Existing heat dissipation systems for electric motors with control electronic boards are inefficient, often requiring metal heat sinks that are costly and difficult to ground, and do not effectively manage heat generation from power modules.

Innovation Solution

A distributed heat dissipation system using a flat metal element on the electronic board adjacent to power modules, coupled with a compression-yielding element and a plastic dissipation surface, to spread heat efficiently across a larger surface area for convection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a metal heat sink is used for heat dissipation, then heat dissipation effectiveness is improved, but device complexity and cost increase due to grounding requirements and insulation features

Engineering Contradiction:
Improveheat dissipation effectivenessVSAvoidgrounding and insulation features
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The invention extracts the heat dissipation function from the traditional metal heat sink and integrates it directly into the housing portion. The housing itself becomes the heat dissipation element through thermally conductive plastic material, eliminating the need for separate metal heat sink components and their associated grounding requirements.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention merges the housing structure with the heat dissipation function by using thermally conductive plastic material for the housing portion. This combination allows the housing to serve dual purposes: structural containment and thermal management, thereby simplifying the overall device structure.

Inventive Principle:
Principle #5Merging (Combining)

2Temperature

If a metal heat sink is used for heat dissipation, then heat dissipation effectiveness is improved, but device size and cost increase

Engineering Contradiction:
Improveheat dissipation effectivenessVSAvoiddevice size
Core Design Contradiction:
TemperatureVSVolume of stationary object

Solution Approach 1:

The housing is designed to serve dual functions as both structural enclosure and heat dissipation element. By integrating these functions, the invention eliminates the need for additional external heat sink components, thereby reducing overall device volume while maintaining effective heat dissipation.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The housing portion is designed with multi-functionality, serving both as the structural housing for electronic components and as the primary heat dissipation element. This universal design approach eliminates the need for separate dedicated heat dissipation components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Temperature

If copper thickness is increased to improve heat conduction, then heat conduction is improved, but manufacturing cost increases

Engineering Contradiction:
Improveheat conductionVSAvoidmanufacturing cost
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The invention changes the material parameter from traditional metal (requiring thick copper) to thermally conductive plastic. This parameter change allows for adequate heat conduction with thinner material sections, simplifying manufacturing processes and reducing costs associated with copper processing and assembly.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This system effectively dissipates heat generated by power modules across a larger surface area, improving thermal conductivity and convection, thereby enhancing heat removal without the need for costly metal heat sinks and ensuring compact size.

Implementation Method 1

Heat transfer localized at the generation point of the power module is provided, to distribute said heat on a larger surface consisting of at least one flat metal element

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a compression-yielding element collects it from the electronic board and brings it to the housing portion which has a dissipation surface

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

the heat being spread on a larger surface to be exchanged by convection with the surrounding environment

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS20240373600A1Electric motor with heat dissipation system
Publication Date: 2024.11.07 TACO ITAL SRL
  • US20240373600A1 patent drawing
  • US20240373600A1 patent drawing
  • US20240373600A1 patent drawing

AI summary

Electric motor with heat dissipation system. The electric motor (100) comprises: an electric motor body (110); at least one electronic board (300) for power supply and control of the electric motor (100), the at least one electronic board (300) comprising at least one power module (301); a housing portion (200; 201, 202) associated with the electric motor body (110) to contain the at least one electronic board (300). The heat dissipation system comprises: at least one flat metal element (302) on at least one surface of the at least one electronic board (300) adjacent to the at least one power module (301); a dissipation surface (211; 212) of the housing portion (200; 201, 202), the dissipation surface (211, 212) being made of plastic; a compression-yielding element (401; 402) in thermal contact between the at least one flat metal element (302) and the dissipation surface (211; 212). In particular, the electric motor (100) is part of a fluid circulator (10).