Motor Coil Substrate With Copper Via Conductors
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Solution Overview
Problem
Existing motor coil substrates for DC motors face challenges in achieving high torque and reliability due to limited turns in the circumferential direction and reliance on solder connections, which are prone to softening under heat and have high resistance, affecting efficiency and durability.
Innovation Solution
A motor coil substrate featuring a flexible insulating substrate with spiral-shaped wirings on both surfaces connected by copper-plated via conductors, wound multiple turns in a cylindrical shape to oppose surfaces, enhancing torque and reliability through low-resistance connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If solder connections are used to connect wirings, then the manufacturing process is simple, but the connection resistance increases and reliability decreases under heat
Solution Approach 1:
The patent replaces the mechanical soldering process with an electrical conduction system using via conductors. Instead of using solder to mechanically and electrically connect wirings, the invention uses conductive paths formed through the insulating substrate, eliminating the thermal and mechanical weaknesses of solder joints while maintaining manufacturing feasibility through electroplating processes.
Solution Approach 2:
The patent changes the connection method from high-resistance solder joints to low-resistance copper via conductors. By altering the material parameter (from solder to copper plating) and the structural parameter (from surface mounting to through-substrate conduction), the invention achieves both low connection resistance and high thermal stability.
2Device complexity
If a single-turn armature is used, then the device complexity is low, but the torque generation is insufficient
Solution Approach 1:
The patent transitions from a single-turn planar structure to a multi-turn cylindrical structure by winding the insulating substrate around a mandrel. This dimensional transformation allows the armature to generate significantly higher torque (2.5 times more than single-turn) while maintaining structural simplicity through the flexibility of the insulating substrate that enables easy winding and compact packaging.
3Reliability
If copper plating is applied to via conductors, then the electrical conductivity increases, but the manufacturing process becomes more complex
Solution Approach 1:
The patent combines multiple manufacturing operations into a single integrated process. The insulating substrate is prepared with through-holes, which are then electroplated with copper in one continuous operation, forming the via conductors. This merging of substrate preparation and conductor formation eliminates separate steps, making the process as feasible as traditional PCB manufacturing while achieving superior electrical conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a 2.5 times higher torque generation compared to a single-turn armature of the same diameter, with high reliability and efficiency due to the low-resistance copper via conductors, overcoming the limitations of existing technologies.
Implementation Method 1
via conductors including copper plating penetrating through the flexible insulating substrate such that the via conductors are connecting the wirings formed on the first surface and the wirings formed on the second surface
Data Source
AI summary
A motor coil substrate includes a flexible insulating substrate having a cylindrical shape, wirings formed on a first surface of the flexible insulating substrate and a second surface of the flexible insulating substrate on the opposite side with respect to the first surface, and via conductors including copper plating penetrating through the flexible insulating substrate such that the via conductors are connecting the wirings formed on the first surface and the wirings formed on the second surface. The wirings and the via conductors form coils formed in spiral shapes, and the flexible insulating substrate is wound more than one turn in a circumferential direction of the cylindrical shape such that the first surface on an inner side of the cylindrical shape and the second surface on an outer side of the cylindrical shape oppose each other.