Motor Controller Assembly With Integrated Cover Cooling
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Solution Overview
Problem
Existing motor assemblies for vehicles face challenges with heat generation and size limitations due to high current usage in controllers, making it difficult to achieve miniaturization and lightweighting while maintaining effective heat dissipation.
Innovation Solution
A controller and motor assembly design that incorporates a power module with a metal cover, utilizing an insert injection method for mold units, allows for vertical placement of large elements, and includes a MOSFET for reverse connection prevention, enhancing heat dissipation and compact structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the size of the substrate is increased to solve heat-generation problem, then heat dissipation is improved, but the size and weight of the motor assembly increase
Solution Approach 1:
The controller cover is integrated with a heat dissipation fin structure, merging the protective cover function with the heat dissipation function into a single component. This eliminates the need for a separate large substrate and dedicated heat dissipation components, reducing overall assembly size and weight while maintaining effective heat dissipation capability.
Solution Approach 2:
Instead of increasing the substrate area in the horizontal plane, the solution extends heat dissipation into the vertical dimension by adding fins that protrude from the controller cover. This allows heat dissipation surface area to increase without increasing the footprint or overall size of the motor assembly.
2Temperature
If the size of the substrate is increased to solve heat-generation problem, then heat dissipation is improved, but the size of motor assembly increases
Solution Approach 1:
The controller cover is integrated with a heat dissipation fin structure, merging the protective cover function with the heat dissipation function into a single component. This eliminates the need for a separate large substrate and dedicated heat dissipation components, reducing overall assembly size and weight while maintaining effective heat dissipation capability.
Solution Approach 2:
Instead of increasing the substrate area in the horizontal plane, the solution extends heat dissipation into the vertical dimension by adding fins that protrude from the controller cover. This allows heat dissipation surface area to increase without increasing the footprint or overall size of the motor assembly.
3Power
If high current is used in the controller, then motor control capability is improved, but heat-generation problem occurs in the substrate
Solution Approach 1:
The high-current power circuit is extracted from the substrate and relocated to a dedicated power module. This separates the heat-generating power conversion function from the control substrate, preventing substrate overheating while maintaining the capability to handle high currents for motor control.
Solution Approach 2:
A power module serves as an intermediary component between the substrate and the motor. This power module handles the high-current power conversion and generates heat away from the substrate, while still allowing the substrate to perform control functions. The power module acts as a buffer that protects the substrate from thermal damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively addresses heat-generation issues, enables compact and lightweight motor assemblies, improves heat dissipation, and allows for component sharing, thereby enhancing reliability and design freedom.
Implementation Method 1
a power module with a metal cover, utilizing an insert injection method for mold units, allows for vertical placement of large elements, and includes a MOSFET for reverse connection prevention, enhancing heat dissipation
Data Source
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AI summary
One embodiment relates to a controller and a motor assembly comprising same, the controller comprising: a controller housing; a controller cover disposed at an opening of the controller housing; a DM filter unit disposed over the controller cover; a CM filter unit disposed over the DM filter unit; a power module unit disposed under the controller cover; a substrate disposed under the power module unit; and a first connector and a second connector which penetrate the controller cover and have one side thereof disposed at the substrate. Accordingly, a heat generation problem can be resolved while miniaturization and weight lightening are realized, and some parts of the controller can be shared.