Motor Controller Cooling Layout for Double-Sided IGBT Heat Dissipation
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Solution Overview
Problem
Existing motor controllers face challenges in heat dissipation due to a small contact area between the coolant and the IGBT module, leading to inefficient heat dissipation and increased thickness, which is not suitable for minimizing the motor controller's size.
Innovation Solution
The motor controller design includes a cooling chamber with insert-in and protrude-out holes for the IGBT module, forming liquid passing gaps with the inner wall, and a capacitor module connected to dissipate heat through a coolant, with multiple cooling chambers and an accommodating groove for enhanced heat dissipation and compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If water channels are provided to dissipate heat from IGBT module and capacitor module, then heat dissipation function is improved, but contact area between coolant and IGBT module is small which reduces heat dissipation efficiency
Solution Approach 1:
The cooling system is segmented into multiple independent water channels, with separate channels for cooling the IGBT module and capacitor module. This segmentation allows optimized coolant flow paths for each component, ensuring adequate cooling contact area for each while maintaining overall heat dissipation efficiency.
2Temperature
If thickness of motor controller is increased to improve heat dissipation, then heat dissipation performance is improved, but motor controller size increases which is not suitable for minimization
Solution Approach 1:
The water channels are designed to extend along the length direction of the motor controller rather than requiring increased thickness. By utilizing the longitudinal dimension for heat dissipation pathways, the design achieves effective cooling without increasing the controller's thickness, thus maintaining a compact form factor.
3Temperature
If multiple cooling chambers and accommodating groove are added for enhanced heat dissipation, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
Multiple cooling chambers are merged into a single integrated first housing structure, with water channels formed within the housing itself rather than as separate components. This merging approach achieves effective multi-zone cooling while reducing the number of discrete parts and simplifying the overall device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves double-sided heat dissipation for both the IGBT and capacitor modules, improving heat dissipation efficiency, reducing size, and enhancing electromagnetic compatibility while maintaining high power density.
Implementation Method 1
two opposite side surfaces of the IGBT module in a thickness direction and an inner wall of the cooling chamber form liquid passing gaps
Implementation Method 2
dissipate heat from both an IGBT (Insulated Gate Bipolar Transistor) module and a capacitor module
Implementation Method 3
the capacitor module is connected to the IGBT module and configured to dissipate heat through a coolant in the cooling chamber
Data Source
AI summary
A motor controller includes: a box including a first housing including a cooling chamber, and an insert-in hole and a protrude-out hole disposed on two opposite sidewalls of the cooling chamber; an IGBT module inserted into the cooling chamber, two opposite side surfaces of the IGBT module in a thickness direction and an inner wall of the cooling chamber forming liquid passing gaps, two ends of the IGBT module sealed with the first housing to seal the insert-in hole and the protrude-out hole; a control board and a drive board disposed in the box, the control board located on a surface of the drive board facing away from the IGBT module, and the drive board connected to the control board and the IGBT module; and a capacitor module located on a surface of the first housing facing away from the drive board and connected to the IGBT module.