Integrated Motor Drive Layout for Heat Dissipation and Assembly
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Solution Overview
Problem
Conventional motor controllers with stacked circuit boards face challenges in heat dissipation, assembly complexity, increased volume, and limited space for components due to solder pads, leading to potential overheating and device failure.
Innovation Solution
An integrated motor and drive assembly with a power board and control board arranged horizontally, utilizing a high thermal conductivity substrate for direct thermal connections and multiple heat-dissipating paths, along with a horizontal layout to simplify assembly and reduce material consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If two circuit boards are stacked vertically to save volume, then the volume of the integrated motor and drive is reduced, but the heat dissipation efficiency deteriorates and assembly complexity increases
Solution Approach 1:
The patent transitions from a vertical stacking arrangement (one dimension) to a horizontal side-by-side arrangement (another dimension). The first and second circuit boards are disposed side by side in a horizontal direction, which eliminates the heat dissipation blocking problem caused by vertical stacking while still achieving compact integration through optimized spatial layout.
Solution Approach 2:
The patent divides the circuit board assembly into two separate boards (first circuit board and second circuit board) that are horizontally arranged rather than stacked. This segmentation allows each board to have its own independent heat dissipation path and eliminates the thermal interference that occurs when boards are vertically stacked.
2Volume of moving object
If two circuit boards are stacked vertically, then space is saved, but the assembly complexity and soldering process difficulty increase
Solution Approach 1:
The patent changes the spatial arrangement from vertical stacking to horizontal side-by-side placement. This dimensional change simplifies the assembly process by eliminating the need for complex vertical alignment and multi-layer soldering, while still achieving compact integration through optimized horizontal space utilization.
3Volume of moving object
If two circuit boards are stacked vertically, then volume is reduced, but the encoder placement space is insufficient
Solution Approach 1:
The patent arranges circuit boards horizontally side by side, which creates additional vertical space above and below the boards. This allows the encoder to be disposed axially in the vertical direction without interfering with the circuit board assembly, thus providing sufficient encoder placement space while maintaining compact overall volume.
4Volume of moving object
If two circuit boards are stacked vertically, then volume is reduced, but the available space for electronic components is decreased
Solution Approach 1:
The patent uses horizontal side-by-side arrangement of circuit boards, which maximizes the utilization of vertical space. This allows electronic components to be mounted on both the top and bottom surfaces of each board without spatial interference, thereby increasing the total available space for electronic components while maintaining compact volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency, simplifies assembly, reduces material costs, and optimizes circuit conduction paths while allowing for better component placement and reduced wiring.
Implementation Method 1
The power board is made of a high thermal conductivity substrate... the second side contacts the housing to form a heat-dissipating path
Data Source
AI summary
An integrated motor and drive assembly is disclosed and includes a housing, a motor and a drive. The housing includes a motor-accommodation portion and a drive-accommodation portion. The drive includes a power board and a control board. The power board is made of a high thermal conductivity substrate and includes a power element and an encoder disposed on the first side, the first side faces the motor, the power board and the motor are stacked along a first direction, and the second side contacts the housing to from a heat-dissipating route. The control board is disposed adjacent to the power board. The control board and the power board are arranged along a second direction perpendicular to the first direction, and the first direction is parallel to an axial direction of the motor. A part of the power board and a part of the control board are directly contacted to form an electrical connection.