Motor Drive Device Heat Radiator Thermal Conduction
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Solution Overview
Problem
The existing motor drive devices that drive multiple motors face structural complexity and size issues due to the need for multiple cooling mechanisms and the placement of semiconductor devices and substrates in a control panel's ventilation space, which leads to potential insulation failures and corrosion from particulates.
Innovation Solution
A motor drive device with a plate-shaped first heat radiation part and a second heat radiation part, where the semiconductor devices are thermally connected to these parts, allowing for efficient heat dissipation and reducing the need for multiple cooling mechanisms, thus simplifying the structure and reducing size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple cooling mechanisms are provided to cool multiple semiconductor devices, then the cooling effectiveness is improved, but the device complexity and size increase
Solution Approach 1:
The patent combines multiple cooling functions into a single integrated heat radiator that can cool multiple semiconductor devices simultaneously. The heat radiator includes multiple heat transfer surfaces that contact different semiconductor devices, allowing one cooling mechanism to perform the function of what would otherwise require multiple separate cooling mechanisms.
Solution Approach 2:
The heat radiator is designed as a universal cooling component that serves multiple semiconductor devices with different heat dissipation requirements. By providing multiple heat transfer surfaces and configurable contact areas, the single heat radiator can adaptively cool multiple devices, reducing the need for device-specific cooling mechanisms.
2Temperature
If semiconductor devices and substrates are placed in the ventilation space for cooling, then the heat dissipation is improved, but the reliability decreases due to particulate adhesion
Solution Approach 1:
The patent extracts the semiconductor devices and substrates from the ventilation space and places them in a separate dustproof space. This separation removes the harmful exposure to particulates while maintaining effective heat dissipation through the heat radiator, which acts as a thermal interface between the protected components and the cooling airflow.
Solution Approach 2:
The heat radiator serves as an intermediary between the semiconductor devices and the ventilation space. It provides thermal contact with the semiconductor devices while being positioned to allow efficient heat transfer to the cooling airflow, enabling the devices to be protected from particulates while still achieving effective cooling.
3Reliability
If special coating and dustproof members are added to prevent particulate adhesion, then the reliability is improved, but the device complexity increases
Solution Approach 1:
Instead of adding protective coatings and dustproof members to the semiconductor devices and substrates, the patent extracts these components from the contaminated ventilation space and places them in a clean dustproof space. This eliminates the need for additional protective structures and coatings, simplifying the overall device design while maintaining reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables structural simplification and size reduction of the motor drive device while maintaining effective heat dissipation, preventing particulate adhesion and improving maintainability by separating the semiconductor devices and substrates from the ventilation space.
Implementation Method 1
The first and second heat transfer surfaces of the heat radiator are each in contact with the semiconductor devices
Implementation Method 2
a cooling mechanism such as a heat radiator or a heat radiation fan
Implementation Method 3
The ventilation space is a space for passage of cooling air
Data Source
AI summary
A motor drive device provided to a control panel to drive a plurality of motors includes a plate-shaped fin base that includes a first plate surface and a second plate surface, and a plate-shaped heat radiator that is thermally connected to the first plate surface and is provided with a first normal to its plate surface intersecting a second normal to the first plate surface. The motor drive device also includes a semiconductor device that drives a first motor and is thermally connected to the heat radiator, a semiconductor device that drives a second motor and is thermally connected to the first plate surface, and fins that are thermally connected to the second plate surface opposite from the first plate surface of the fin base and are provided in an air passage formed in the control panel.