Double-Sided Motor Driver Layout for Higher Heat Dissipation Density
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Solution Overview
Problem
Conventional motor drivers suffer from increased heat dissipation area and reduced heat dissipation density due to thermal modules being disposed on the same side of the heat dissipation element, leading to reduced power density and increased volume.
Innovation Solution
The motor driver design features two thermal modules on the upper surface and one on the lower surface of a heat dissipation plate, utilizing double-sided cooling to enhance heat dissipation efficiency and reduce volume, while symmetrically arranging capacitor packs on opposite sides of the plate to minimize loop leakage inductance and power transmission paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If all thermal modules are disposed on the same side of the heat dissipation plate, then the structure is simple and easy to manufacture, but the heat dissipation area is reduced and heat dissipation density is lowered
Solution Approach 1:
The patent transitions from single-sided thermal module arrangement to double-sided arrangement on the heat dissipation plate, utilizing the third dimension (z-axis) to increase heat dissipation area without increasing the planar footprint, thereby resolving the contradiction between structural simplicity and heat dissipation density
2Temperature
If thermal modules are arranged to maximize heat dissipation area, then heat dissipation density improves, but the overall volume of the motor driver increases
Solution Approach 1:
By arranging thermal modules on both sides of the heat dissipation plate, the patent increases heat dissipation area within the same volume envelope, improving heat dissipation density without increasing the overall motor driver volume
3Ease of manufacture
If capacitor packs are arranged asymmetrically, then the layout is flexible for manufacturing, but the loop leakage inductance increases and current equalization is poor
Solution Approach 1:
The patent employs symmetric arrangement of capacitor packs on opposite sides of the heat dissipation plate, creating balanced current paths that reduce loop leakage inductance and improve current equalization, while maintaining manufacturing flexibility through standardized symmetric positioning
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation density and power density, reduces the motor driver's volume, and lowers loop leakage inductance, while also equalizing current and reducing costs.
Implementation Method 1
The first thermal module is disposed on the upper surface. One of the second thermal module and the third thermal module is disposed on the lower surface and the other one of the second thermal module and the third thermal module is disposed on the upper surface
Data Source
AI summary
A motor driver is provided. The motor driver includes an AC/DC converter, a DC/AC converter, a heat dissipation plate and a busbar module. The AC/DC converter converts an AC input power to a DC power and includes a first thermal module, a second thermal module, a first capacitor pack and a second capacitor pack. The DC/AC converter is connected with the AC/DC converter, converts the DC power to an AC output power, and includes a third thermal module. The heat dissipation plate includes an upper surface and a lower surface. The first thermal module is disposed on the upper surface. The second thermal module and the third thermal module are disposed on two opposite surfaces, respectively. The first capacitor pack is disposed on the upper surface. The second capacitor pack is disposed on the lower surface and corresponding to the first capacitor pack.