Multi-Phase Motor Driver Package With Fast Fault Shutdown
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Solution Overview
Problem
Conventional semiconductor packages for multi-phase motor driving circuits face challenges in detecting insulation faults and fault currents efficiently, leading to potential electrical shock and fire risks, and requiring longer times to shut down power switches, which can damage the motor system.
Innovation Solution
The semiconductor package includes a driving unit with multiple driving ICs, a switching unit with power switches, and bonding wires that connect sensing pins and fault out pins between the driving ICs, allowing for direct communication and fault signal transmission without relying on the controller, thereby reducing response time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the conventional semiconductor package uses separate driving ICs for each phase with current sensing through electrical lines to the MCU, then the system can detect faults, but the response time is delayed due to the need for MCU processing and command transmission
Solution Approach 1:
The patent merges the fault detection and shutdown control functions directly into the driving ICs themselves. Each driving IC includes current sensing circuitry and shutdown control logic, eliminating the need for separate MCU processing. When a fault is detected through the sensing pin, the driving IC automatically activates the shutdown control signal to turn off the power switches immediately, achieving both reliable fault detection and rapid response time within the same integrated component.
2Reliability
If the conventional package transmits current and temperature data through electrical lines to the MCU for processing, then fault detection is achieved, but the system complexity increases and response speed decreases
Solution Approach 1:
The patent extracts the fault detection and shutdown control functions from the external MCU system and embeds them directly within the driving IC. The sensing pin on the driving IC directly monitors current and temperature, and the shutdown control signal is generated and executed within the same IC, removing the need for complex external signal transmission and processing pathways.
3Object-affected harmful factors
If the conventional system relies on MCU commands to shut down power switches after detecting over current or over temperature, then safety functions are implemented, but the response time is extended due to multiple processing steps
Solution Approach 1:
The patent implements preliminary action by pre-integrating the shutdown control logic and signal generation capability directly within the driving IC. When fault conditions are detected through the sensing pin, the shutdown control signal is immediately activated without requiring external MCU intervention, enabling the power switches to turn off as quickly as the fault detection itself, thereby minimizing the time harmful factors can affect the system.
Data Source
AI summary
A semiconductor package for a multi-phase motor driving circuit comprises a driving unit, a switching unit, a first bonding wire, and a second bonding wire. The driving unit comprises a first driving IC, a second driving IC and a third driving IC, configured to couple with a controller. The switching unit comprises a first pair of power switches, a second pair of power switches and a third pair of power switches, configured to couple with the first driving IC, the second driving IC and the third driving IC, respectively. The first bonding wire is coupled between a sensing pin of the first driving circuit and a connection between the driving unit and a motor driven by the driving. The second bonding wire is coupled between a fault out pin of the first driving IC, the second driving IC and the third driving IC.