SiP Motor Driver with MEMS Sensor for Fault Diagnosis
Solution Overview
Problem
Existing motor fault diagnosis methods, particularly for rotating motors, are inefficient in providing early and real-time detection, often requiring external modules and complex sensor layouts, leading to high costs and large PCB footprints, and struggle with noise immunity and calibration complexity.
Innovation Solution
A System in Package (SiP) integration of MEMS sensors and motor driver circuitry within a common package, utilizing a sample and hold circuit synchronized with PWM control signals to collect and process non-motor winding data for real-time fault diagnosis, enabling on-line monitoring and reducing power consumption and system complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If external sensor modules and complex sensor layouts are used for motor fault diagnosis, then measurement precision is improved, but device complexity increases and PCB footprint increases
Solution Approach 1:
The patent combines multiple sensor types (accelerometer, gyroscope, magnetometer, temperature sensor, pressure sensor) and motor driver circuitry into a single integrated SiP package. This merging eliminates the need for separate external sensor modules and complex PCB layouts, while maintaining comprehensive fault diagnosis capability through the integrated sensors' ability to detect vibration, temperature, and other fault indicators.
2Reliability
If multiple sensors are used for comprehensive motor fault diagnosis, then reliability is improved, but use of energy increases
Solution Approach 1:
The SiP integration merges multiple sensors and processing circuitry into a single package, enabling shared power management and reduced total power consumption compared to discrete implementations. The integrated architecture allows efficient coordination of multiple sensors for comprehensive fault detection while managing energy usage through unified control.
Solution Approach 2:
The patent implements periodic sampling of sensor data at optimized intervals, rather than continuous monitoring. The sample and hold circuit captures sensor signals at specific timing relative to PWM control signals, providing sufficient fault diagnosis data while minimizing power consumption during non-sampling periods.
3Productivity
If real-time monitoring is implemented for early fault detection, then productivity is improved through early detection, but device complexity increases
Solution Approach 1:
The SiP package merges motor driver functionality with diagnostic sensor integration, enabling real-time monitoring capabilities to be built into the motor control system itself rather than requiring separate external monitoring hardware. This integration achieves early fault detection while avoiding the complexity of separate monitoring systems.
Solution Approach 2:
The integrated SiP enables the motor system to perform self-diagnosis through built-in sensors that monitor vibration, temperature, and operational parameters. The system automatically detects faults and can trigger protective actions without external monitoring equipment, achieving early detection while simplifying the overall system architecture.
Data Source
AI summary
A system in package encloses a sensor and motor driver circuit. In an implementation, the sensor is an integrated circuit micro-electro-mechanical-systems (MEMS) sensor and the driver circuit is a motor driver circuit. Non-motor winding data information is sensed by the MEMS sensor and processed for the purpose of characterizing known fault patterns for motors; characterizing normal operation of the motor; and evaluating continued operation of the motor to detect abnormal motor behavior and instances of motor fault. The motor is driven using PWM control and the information output by the MEMS sensor is sampled at sampling times having a fixed timing relationship relative to the PWM control signals.