Motor Driving Electronic Device with Stacked Wiring Substrates
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Solution Overview
Problem
Existing motor driving electronic devices face limitations in performance improvement, particularly in terms of efficiency and space utilization in motor control systems.
Innovation Solution
The electronic device comprises a power wiring substrate and a control wiring substrate with specific semiconductor devices and voltage generation circuits, allowing for improved power management and control through a structured arrangement of MOSFETs, resistors, and voltage conversion, enabling efficient motor driving and reduced space requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor devices are mounted on wiring substrates for motor driving, then functional integration is improved, but device complexity and space requirements increase
Solution Approach 1:
The electronic device is divided into four distinct semiconductor devices (first power transistor device, second power transistor device, voltage generation device, control device) mounted on separate wiring substrates. This segmentation allows each device to perform its specific function independently while maintaining overall system integration, resolving the contradiction between functional integration and device complexity.
Solution Approach 2:
The patent utilizes three-dimensional stacking of wiring substrates (first wiring substrate and second wiring substrate positioned at different heights) to accommodate multiple semiconductor devices. This vertical arrangement reduces planar space requirements while maintaining functional integration, effectively managing device complexity through spatial optimization.
2Use of energy by moving object
If wiring substrates with multiple semiconductor devices are used, then power management capability is improved, but space usage increases
Solution Approach 1:
The patent combines power management functions (voltage generation circuit in the fourth semiconductor device) and control functions (control circuit in the fifth semiconductor device) into a single integrated electronic device structure. This merging approach improves power management capability while reducing the overall space required compared to separate discrete components.
Solution Approach 2:
By arranging wiring substrates vertically (first wiring substrate and second wiring substrate at different vertical levels) and mounting semiconductor devices on both substrates, the patent utilizes three-dimensional space to accommodate multiple functional components. This reduces the planar footprint while maintaining comprehensive power management capability.
3Productivity
If voltage generation circuits are integrated into the motor driving device, then system efficiency is improved, but device complexity increases
Solution Approach 1:
The voltage generation circuit is segregated into a dedicated fourth semiconductor device (voltage generation device) mounted on the second wiring substrate. This segmentation allows the voltage generation function to be optimized independently while contributing to overall system efficiency, and the modular structure helps manage device complexity through clear functional separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the performance of motor driving systems by optimizing power conversion and control, reducing space usage and weight, and improving fuel efficiency in applications like fuel pumps.
Implementation Method 1
a voltage generation circuit for converting, into a second power supply voltage, a first power supply voltage supplied from outside
Data Source
AI summary
A first semiconductor device having a power transistor for switching is mounted on a power wiring substrate PB1; a semiconductor device PKG6 having a driving circuit for driving the first semiconductor device and a semiconductor device PKG5 having a control circuit for controlling the semiconductor device PKG6 are mounted on a first principal surface of a control wiring substrate PB2; and a semiconductor device PKG4 having a regulator circuit is mounted on a second principal surface of the control wiring substrate PB2. On the first principal surface of the control wiring substrate PB2, the semiconductor device PKG5 and the semiconductor device PKG6 are mounted in a second area out of the second area and a third area adjacent to each other via a first area in which a plurality of holes HC3 are arranged. On the second principal surface of the control wiring substrate PB2, the semiconductor device PKG4 is mounted in a fifth area out of a fourth area positioned opposite the second area and the fifth area positioned opposite the third area.