Motor EMC Ground Structure for Stable ESD Connection

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Solution Overview

Problem

The EMC and ESD components of motors experience unstable grounding due to temperature variations and vibrations, leading to potential electromagnetic interference and electro-static discharge issues.

Innovation Solution

A ground structure is introduced, featuring a conductive housing, an insulating cover with conductive terminals, and a second pin located between the conductive housing and cover, which is secured through an open slot or engaging components, ensuring stable grounding even under thermal and vibrational stress.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the EMC component and/or ESD component is directly contacted to the metal conductive housing through the insulating cover, then the grounding purpose is achieved, but the contact becomes insufficient or unstable under temperature variation and vibration

Engineering Contradiction:
Improvegrounding stabilityVSAvoidcontact stability
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent divides the grounding path into multiple segments: the second pin contacts both the conductive housing and conductive cover, creating redundant contact points. This segmentation ensures that if one contact point becomes unstable due to temperature or vibration, the other maintains the grounding connection.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies different material properties to different parts of the grounding structure. The conductive cover is made of metal with high thermal conductivity and structural stability, while the insulating cover remains plastic. This local quality differentiation ensures stable electrical contact in the critical grounding path while maintaining the protective insulation elsewhere.

Inventive Principle:
Principle #3Local quality

2Reliability

If the insulating cover is made of plastic material, then the electronic components are protected from shorting out, but the cover deforms under high temperature and severe vibration

Engineering Contradiction:
Improveelectronic component protectionVSAvoidresistance to deformation
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent divides the housing structure into two functional segments: the insulating cover for protection and the conductive cover for stable electrical contact. By separating these functions into different materials and structures, each can be optimized for its specific purpose without compromising the other.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent employs a composite structure combining plastic insulating material and metal conductive material in different parts of the housing. This composite approach allows the plastic portion to provide insulation while the metal portion provides thermal stability and vibration resistance for the grounding path.

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS10644572B2Motor and ground structure of EMC element and/or ESD element thereof
Publication Date: 2020.05.05 CHIAPHUA COMPONENTS SHENZHEN
  • US10644572B2 patent drawing
  • US10644572B2 patent drawing
  • US10644572B2 patent drawing

AI summary

A motor and a ground structure of an EMC component and/or ESD component for the motor, wherein the ground structure includes a conductive housing, an insulating cover; the insulating cover is provided with an EMC component and/or ESD component, and an conductive terminal connected to the EMC component and/or ESD component; the ground structure further includes a conductive cover; the first pin of the EMC component and/or ESD component is connected to the conductive terminal; the second pin of the EMC component and/or ESD component is located between the conductive housing and the conductive cover, such that the EMC component and/or ESD component can still be grounded stably even when the insulating cover is deformed because of temperature and vibration.