Motor Power Converter Grounding Layout for Compact Heat Dissipation

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Solution Overview

Problem

Existing motor power converters face challenges in reducing size while preventing abnormal voltage application to components and minimizing electric current loss during normal operation, due to issues with resistor burnout and high-voltage wire routing limitations.

Innovation Solution

A motor power converter design where the high-voltage and low-voltage circuit grounds are connected at one point via a resistor with small power capacitance, limiting short-circuit current and disconnecting when necessary to interrupt high direct-current voltage, allowing for size reduction and efficient heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the motor is reduced in size by using surface-mounted ICs and compact power converter design, then productivity and compactness are improved, but heat dissipation becomes more difficult due to limited space for heat radiation

Engineering Contradiction:
Improvemotor sizeVSAvoidheat dissipation capability
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

A cooling fan is incorporated into the motor design to provide forced air convection cooling. This pneumatic cooling mechanism enables effective heat dissipation from the compact power converter and motor components by creating airflow that removes heat, resolving the contradiction between compact size and heat dissipation capability.

Inventive Principle:
Principle #29Pneumatics and hydraulics

2Productivity

If high-voltage wires are routed through the lower part of the IC and periphery, then wiring efficiency is improved, but the area available for wire routing is extremely limited due to die holes for holding the substrate

Engineering Contradiction:
Improvewiring efficiencyVSAvoidavailable routing area
Core Design Contradiction:
ProductivityVSArea of stationary object

Solution Approach 1:

The circuit ground connection is moved from the traditional planar routing approach to a vertical through-hole connection. The high-voltage wire is routed through a via (vertical hole) from one side of the substrate to the other, utilizing the third dimension (depth) rather than only the surface plane. This dimensional change provides adequate routing space while maintaining wiring efficiency.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design achieves a reduction in motor size and prevents abnormal voltage application to components, while minimizing electric current loss during normal operation by effectively managing high direct-current voltage and heat dissipation.

Implementation Method 1

a resistor with small power capacitance, limiting short-circuit current

Methodology Applied
Scientific EffectElectrical Resistance: Electrical Resistance

Implementation Method 2

a semiconductor module, which converts a voltage of an external power supply into a high-frequency voltage

Methodology Applied
Scientific EffectElectrical Switching:

Data Source

PatentUS10027268B2Motor incorporating power converter, and air conditioner, water heater, and ventilation blower incorporating the motor
Publication Date: 2018.07.17 MITSUBISHI ELECTRIC CORP
  • US10027268B2 patent drawing
  • US10027268B2 patent drawing
  • US10027268B2 patent drawing

AI summary

A motor incorporating a power converter including a printed board on which a semiconductor module (an inverter IC), which converts a voltage of an external power supply into a high-frequency voltage and supplies the high-frequency voltage to a stator, is mounted, wherein a high-voltage circuit ground, which is a power ground of a high-voltage main circuit system of the inverter IC, and a low-voltage circuit ground, which is a ground of a control circuit system, which is a low-voltage circuit, of the semiconductor module, are provided on the board, and the high-voltage circuit ground and the low-voltage circuit ground are connected at one point via a resistor.