Motor Housing Thermal Conduction in Electronic Devices

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Solution Overview

Problem

As electronic devices become smaller and more powerful, they face challenges in effectively dissipating increased heat generation, leading to potential malfunctions and damage due to rising temperatures.

Innovation Solution

The electronic device incorporates a motor housing with a first surface that directly or indirectly contacts the printed board assembly to receive heat from heat generating elements, and a second surface that contacts the battery support frame to transfer this heat, utilizing thermal interfaces made of flexible thermally conductive materials to enhance heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the area of a structure for heat transfer and dissipation is increased, then heat dissipation capability is improved, but size and weight of the electronic device increase

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidweight of electronic device

Core Design Contradiction:

TemperatureVSWeight of stationary object

Solution Approach 1:

The motor housing is designed to serve dual functions: as a structural component housing the motor and as a heat dissipation structure. The first surface of the motor housing contacts the printed board assembly to receive heat, while the second surface contacts the battery support frame to transfer heat, effectively merging the motor housing into the heat dissipation pathway without adding separate heat sink components.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The motor housing is designed with multi-functionality, serving both as a protective enclosure for the motor and as a thermal management component. By integrating heat reception and transfer surfaces into the motor housing structure, the design eliminates the need for additional dedicated heat dissipation components, thereby maintaining a compact size while improving heat dissipation capability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If the area of a structure for heat transfer and dissipation is increased, then heat dissipation capability is improved, but size of the electronic device increases

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidsize of electronic device

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The heat dissipation pathway is extended in the vertical dimension by utilizing the motor housing as an intermediate structure between the printed board assembly (where heat generating elements are located) and the battery support frame. This vertical arrangement allows heat to be transferred through multiple surfaces of the motor housing, effectively increasing the heat dissipation area without significantly increasing the horizontal footprint of the device.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively spreads heat across a wider area of the electronic device, reducing the risk of temperature-related malfunctions and enhancing the performance of heat generating elements by improving heat dissipation efficiency.

Implementation Method 1

a first surface configured to directly or indirectly contact the printed board assembly and to receive a heat of the heat generating element from the printed board assembly, and a second surface configured to directly or indirectly contact the battery support frame and to transfer a heat of the heat generating element to the battery support frame

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

utilizing thermal interfaces made of flexible thermally conductive materials to enhance heat dissipation

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250147560A1Electronic device comprising motor housing

Publication Date: 2025.05.08 SAMSUNG ELECTRONICS CO LTD

AI summary

Provided is an electronic device including a motor housing. The electronic device including at least one heat generating element may include a printed board assembly on which the heat generating element is disposed; a battery; a battery support frame configured to support the battery therein; and a motor disposed between the printed board assembly and the battery support frame. The motor may include a motor housing including a first surface configured to directly or indirectly contact the printed board assembly and to receive a heat of the heat generating element from the printed board assembly, and a second surface configured to directly or indirectly contact the battery support frame and to transfer a heat of the heat generating element to the battery support frame.