Motor-Sealing Resin Composition for Heat Transfer Without Cracking

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Solution Overview

Problem

Existing motor-sealing resin compositions with high thermal conductivity inorganic filling materials face issues with increased elastic modulus, leading to cracking during temperature cycling due to stress changes.

Innovation Solution

A motor-sealing resin composition comprising an epoxy resin, a hydrosilylation reaction product of an alkenyl group-containing epoxy compound and organopolysiloxane, a phenolic curing agent, a black pigment, and an inorganic filling material, which maintains low elastic modulus and thermal resistance even with a large inorganic filling content.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a large amount of thermoconductive inorganic filling material is blended in a composition to improve thermal conductivity, then thermal conductivity is improved, but the elastic modulus of the cured material increases causing cracking under stress changes

Engineering Contradiction:
Improvethermal conductivityVSAvoidelastic modulus
Core Design Contradiction:
TemperatureVSStrength

Solution Approach 1:

The patent uses a composite resin system combining epoxy resin and silicone resin with inorganic filling materials to achieve both high thermal conductivity and low elastic modulus. The composite structure allows the epoxy resin to provide thermal conductivity while the silicone resin maintains flexibility and reduces the overall elastic modulus of the cured material.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent changes the chemical composition parameters by incorporating silicone resin and controlling the ratio of inorganic filling materials to resin components. This parameter adjustment allows the cured material to maintain low elastic modulus even with high inorganic filling content, preventing cracking while preserving thermal conductivity.

Inventive Principle:
Principle #35Parameter changes

2Temperature

If a large amount of inorganic filling material is contained to improve thermal conductivity, then thermal conductivity is improved, but the resin composition loses fluidity and applicability for sealing

Engineering Contradiction:
Improvethermal conductivityVSAvoidfluidity
Core Design Contradiction:
TemperatureVSEase of operation

Solution Approach 1:

The combination of epoxy resin and silicone resin creates a composite composition that maintains fluidity despite high inorganic filling content. The silicone resin component specifically contributes to maintaining workability and fluidity, allowing the composition to be easily applied for sealing motor parts while still achieving high thermal conductivity.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

By adjusting the composition parameters including the type and amount of inorganic filling materials and the resin system configuration, the patent maintains optimal fluidity for sealing applications. The specific parameter ranges defined in the patent ensure the composition remains workable while achieving the desired thermal conductivity.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves excellent fluidity, toughness, thermal resistance, and thermal conductivity while maintaining electrical properties, suitable for sealing motor parts without cracking under stress changes.

Implementation Method 1

a hydrosilylation reaction product of an alkenyl group-containing epoxy compound and organopolysiloxane having one or more hydrosilyl groups in one molecule

Methodology Applied
Scientific EffectHydrosilylation reaction: Chemical Bonding

Implementation Method 2

a composition of an epoxy resin using aluminum oxide as a highly thermoconductive inorganic filling material

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP4663680A1Motor-sealing resin composition
Publication Date: 2025.12.17 SHIN ETSU CHEMICAL CO LTD
  • EP4663680A1 patent drawingFigure 1A~1B
  • EP4663680A1 patent drawing
  • EP4663680A1 patent drawing

AI summary

A motor-sealing resin composition for sealing a part or the whole of parts constituting a motor, comprising: (A) an epoxy resin, (B) a hydrosilylation reaction product of an alkenyl group-containing epoxy compound and an organopolysiloxane including one or more hydrosilyl groups in one molecule, (C) a phenolic curing agent, (D) a black pigment, and (E) an inorganic filling material with the proviso that the black pigment (D) is excluded.